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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

Knocking Down the Bone Pile: X-ray Inspection of Ball Grid Array Solder Joints

08/07/2026 | Nash Bell -- Column: Knocking Down the Bone Pile
Ball grid array (BGA) devices are ubiquitous in electronic products primarily due to their advantages, including compact packaging, greater durability than leaded devices, and improved performance from shorter signal paths. BGAs improve electrical performance by reducing inductance and capacitance between the internal silicon die and the PCB, resulting in superior signal integrity and faster operation speeds. BGAs also offer superior thermal performance by dissipating heat more effectively, reducing the risk of overheating.

BOOK EXCERPT: The Printed Circuit Designer’s Guide to... UV Curable Conformal Coatings

06/09/2026 | I-Connect007
Chapter 1: Options for Protecting Electronic Assemblies and a Deep Dive into UV Conformal Coatings. Electronics, depending on fit and function, have different protective options including conformal coatings, potting materials, encapsulants, protective enclosures, sealing and gaskets.

Trouble in Your Tank: The Role of Organic Solderability Preservatives in Advanced Packaging

06/08/2026 | Michael Carano -- Column: Trouble in Your Tank
Technology trends shaping the electronics industry supply chain—AI, IoT, ADAS, and high-performance computing (HPC)—are driving finer circuit features and higher layer counts. Advanced packaging drives the selection of surface finishes depending on the application. Typical designs require excellent solder joint reliability and wire bondability. It is not uncommon for designers to specify the organic solderability preservatives (OSP) on the BGA side of the substrate and precious-metal-plated finishes on the top side, which facilitate wire bonding.

Roundtable: Data Protection Lays the Groundwork for Cybersecurity Strategies

05/04/2026 | Nolan Johnson, I-Connect007
This multi-expert roundtable explores cybersecurity measures specific to electronics manufacturing. NEC’s Watanabe Hiroyuki, Ali Pabrai, CEO at EC First, and Divyash Patel, CEO of MX2 Technologies, join moderator Nolan Johnson for a deeper discussion on cybersecurity certifications.

SMT Perspectives & Prospects: 12 Predictions for Using AI in 2026

01/21/2026 | Dr. Jennie Hwang -- Column: SMT Perspectives and Prospects
At a committee meeting in Washington, D.C., someone asked me if I think AI is a bubble. Over the past several months, this has become a prevalent and pervasive question in both business circles and broader society. Yet, despite its ubiquity, no one had ever asked me that question directly, and especially with such immediacy in front of a committee. My instinctive reply was, “It depends on how you define the bubble. It is certainly not an internet bubble.” The querier lamented, almost disappointed, “Well, you are in the minority.”
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