VIA Announces Strategic Collaboration with Solectrix
March 13, 2025 | VIA optronics AGEstimated reading time: 1 minute
VIA optronics AG, a leading supplier of interactive display solutions, today announced a new strategic collaboration with Solectrix GmbH, a full-service provider in the embedded electronics sector.
The companies intend to use their combined expertise and capabilities to design, develop, and produce advanced camera and display technologies as well as embedded vision systems. Within the cooperation VIA will handle the development of camera and interactive display technologies while Solectrix will work in the field of the development of related electronic control units, as well as embedded systems and software. This combination of expertise enables both companies to develop scalable, robust solutions for a range of applications, including industrial automation, security, monitoring, and other high-performance markets. Both companies contribute to the cooperation with unique technologies and patents to address the market demands.
Dr. Jasmin Wagner, Chief Sales and Marketing Officer of VIA, commented, “We are thrilled to announce this strategic collaboration with Solectrix. We will leverage our shared knowledge and expertise to provide complete camera systems to our customers in various markets. We are pleased to find a partner to bring our products and technologies on a next level.”
Stefan Schütz, Managing Director of Solectrix, remarked, “We are excited to collaborate with VIA optronics to combine their cutting-edge camera and display technologies with our expertise in embedded vision and video processing units, including our SXVPU platform. This partnership allows us to create powerful and scalable solutions tailored to the specific needs of our customers across various industries. By leveraging the strengths of both companies, we aim to set new standards in innovation and reliability, particularly in the DACH region and the wider European market.”
Suggested Items
STMicroelectronics Details Company-Wide Program to Reshape Manufacturing Footprint and Resize Global Cost Base
04/14/2025 | STMicroelectronicsSTMicroelectronics N.V., a global semiconductor leader serving customers across the spectrum of electronics applications, disclosed further elements of its program to reshape its global manufacturing footprint.
Siemens Acquires DownStream Technologies to Expand PCB Design-to-Manufacturing Flow
04/08/2025 | SiemensSiemens Digital Industries Software announced that it has completed the acquisition of DownStream Technologies, a leading provider of manufacturing data preparation solutions for printed circuit board (PCB) design.
Mycronic’s Global Technologies Acquires United Kingdom Based RoBAT
04/07/2025 | MycronicMycronic’s Global Technologies division has acquired RoBAT, a company headquartered in the United Kingdom, which has developed a technology for fast and reliable tests of signal quality on PCBs.
IPC APEX EXPO Special Sessions: A Focus on Advanced Electronic Packaging
04/09/2025 | Tracy Riggan, IPCThe IPC Technology Solutions team hosted two special sessions on Thursday, March 20 at IPC APEX EXPO 2025 focused on advanced electronic packaging. The first session focused on AI/data center applications and the second on power electronics applications. The day kicked off with opening remarks on strategic direction of IPC in the area of advanced electronic packaging from Matt Kelly, IPC CTO, and an overview of the current landscape of component and system level packaging by Devan Iyer, PhD, IPC chief strategist, advanced packaging.
Nokia, Honeywell Aerospace Technologies Partner with Numana to Advance Quantum-safe Networks
04/01/2025 | HoneywellNokia and Honeywell Aerospace Technologies announced a strategic partnership with Numana to advance Quantum-Safe Networks (QSN) in Montreal, Canada, and worldwide.