European Chips Diversity Alliance Hosts Future Proofing Access to Diverse Talent Event to Strengthen Semiconductor Workforce
March 10, 2025 | SEMIEstimated reading time: 1 minute
The European Chips Diversity Alliance (ECDA), a European Union-funded initiative coordinated by SEMI Europe, today announced a full-day event on March 27 dedicated to advancing underrepresented groups in the semiconductor industry in collaboration with Learnovate, MIDAS Ireland, and EudaOrg.
Hosted at Dublin City University, Future Proofing Access to Diverse Talent in the Semiconductor Industry will bring together industry leaders, researchers, and professionals to foster meaningful dialogue and actionable strategies for building a more sustainable workforce.
“This event is a crucial bringing together of key stakeholders, to align talent strategies with broader economic and policy goals, ensuring Europe’s semiconductor ecosystem remains globally competitive,” said Laith Altimime, President of SEMI Europe.
As the demand for skilled professionals in microelectronics continues to surge, the challenge of filling open roles persists. A study by ManpowerGroup showed that 77% of employers globally report difficulties in hiring, while 57% of consumers express loyalty to socially responsible companies according to Deloitte. Addressing these issues requires a proactive approach to workforce development that prioritizes inclusion and equitable opportunities for all talent.
The event will feature discussions and presentations from distinguished industry and academic leaders, exploring the latest research on workforce diversity and practical strategies for fostering inclusion. Experts will share real-world case studies on successful workforce development initiatives and engage attendees in interactive sessions designed to equip them with tools for driving meaningful change within their organizations.
“Diversity plays a crucial role in fostering creativity and problem-solving,” said Nessa Maguire, Director at EudaOrg. “Inclusive teams bring varied perspectives, leading to breakthrough technologies and more resilient supply chains.”
This gathering highlights the semiconductor industry’s commitment to not only attracting but also retaining the next generation of talent. Future-Proofing Access to Diverse Talent in the Semiconductor Industry will take place on March 27, 2025, at Dublin City University’s St Patrick’s Campus.
Suggested Items
Hon Hai Product Chief Xiao Caiyou Elected as Member of the Board of Directors of the NAM
04/15/2025 | Hon Hai Technology GroupHon Hai Technology Group, the world’s largest technology manufacturing and service provider, announced that Jerry Hsiao, Chief Product Officer and General Manager of the U.S. Regional Headquarters, has been invited by the National Association of Manufacturers ( NAM ) to officially join the NAM Board of Directors to help promote the competitiveness of the U.S. manufacturing industry and related policy initiatives.
Explore TRI's Test and Inspection Innovations at ElectroneX
04/15/2025 | TRIGPC Electronics, TRI's industry partner, will participate in the ElectroneX Electronics Design & Assembly Expo 2025 at the Melbourne Convention & Exhibition Centre, Australia, on May 7–8, 2025.
Industry Voices Highlighted in the April 2025 Issue of PCB007 Magazine
04/15/2025 | I-Connect007 Editorial TeamWe take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue of PCB007 Magazine. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
IPC Welcomes Exemptions to Reciprocal Tariffs
04/14/2025 | IPCIPC shared the following statement today on tariff exclusions and their implications on the global electronics industry. This statement can be attributed to Dr. John W. Mitchell, IPC president and CEO:
AIM to Highlight Type 5 Solder and Other Leading Products at SMTA Capital Expo & Tech Forum
04/11/2025 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Capital Expo & Tech Forum taking place on May 8 at George Mason University – Mason Square in Arlington, Virginia.