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Teradyne Announces Succession Plan for Semiconductor Test Division

03/07/2025 | BUSINESS WIRE
Teradyne, Inc. announced that Shannon Poulin has joined Teradyne to succeed Rick Burns as President of the Semiconductor Test Division in Q2 2025. Mr. Burns plans to retire on June 1, 2025.

Statement from IPC, the Global Electronics Association, on Recent U.S. Tariffs and Global Trade

03/07/2025 | IPC
IPC shared the following statement today on U.S. tariffs and their implications on the global electronics industry. This statement can be attributed to Dr. John W. Mitchell, IPC president and CEO:

Summit Interconnect Announces Key Executive Appointments: Sean Patterson Named CTO, Michael Norman Joins as President and COO

03/06/2025 | Summit Interconnect, Inc.
Summit Interconnect, a leading provider of advanced PCB manufacturing solutions, is pleased to announce two key leadership updates to its executive team.

IPC Strengthens Its Global Executive Leadership Team

03/04/2025 | IPC
In an effort to strengthen service to its more than 3,200 corporate global members, IPC announces the transition of two of its executive leadership staff into new IPC roles.

Samsung Display Partners with Intel to Target Next-Gen AI PC Market

02/24/2025 | Samsung Display Company
Samsung Display has signed a Memorandum of Understanding (MoU) with Intel®, a global semiconductor company, showing both companies’ intent to cooperate in the development of next-generation IT technology and joint marketing efforts.
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