Facing the Future: The Role of 5G and Beyond in Shaping PCB Demand
It’s Only Common Sense: Stop Pitching, Start Listening
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
March 7, 2025 | Andy Shaughnessy, I-Connect007Estimated reading time: 2 minutes
It’s been a busy week. My must-reads include articles and news items on global trends and challenges, groundbreaking technology, the hunt for the elusive young PCB designers, and some personnel changes. We also have a great column on the value of following up and keeping promises. We’re all guilty of “dropping the ball” from time to time, aren’t we? So, how do you recover?
IPC APEX EXPO takes place in Anaheim, California, March 18-20, and we’ll be there from ribbon-cutting through the final announcement telling everyone that the show is closed. We’ll be bringing you Real Time with… video interviews with the movers and shakers in PCB design, fabrication, assembly, and test. I’ll be glad to get out of Atlanta—it’s freezing here.
If you’re at the IPC show, stop by our booth and say hello. In the meantime, have a good weekend.
IMAPS’ Annual Conference Opener in Phoenix ‘Blew My Mind’
Published March 5
PCB007 Editor Marcy LaRont brings us this review of the first day’s events at the IMAPS Device Packaging Conference in Phoenix this week. As she explains, there was a lot of attention paid to AI and advanced packaging substrates, including glass. I understand the appeal of glass at the packaging level. I’ve heard some PCB fabricators discuss using glass; has anyone on the PCB side ever utilized glass?
UHDI Fundamentals: UHDI Advances Neurotechnology
Published March 5
If you’ve been following Anaya Vardya’s UHDI series, you’re aware that his new technology is a real game-changer. In this installment, Anaya explains how UHDI figures into the development of neurotechnology, especially brain-computer interfaces (BCI). It’s a brave new world for UHDI, and the innovation is only getting started.
Summit Interconnect Announces Key Executive Appointments: Sean Patterson Named CTO, Michael Norman Joins as President and COO
Published March 6
Summit Interconnect has new leadership now, with COO Sean Patterson becoming the company’s first CTO. Michael Norman joins Summit from Raytheon, becoming president and COO. Shane Whiteside will continue as CEO and chairman of the board.
It’s Only Common Sense: Follow Through and Keep Your Promises
Published March 3
Dan Beaulieu really nails it this week: We work in a blizzard of emails and texts, so following up is a real necessity. There’s really no excuse for failing to follow up, and we’re all guilty of this at one time or another. But we all know which of our friends, customers, and suppliers are the most likely to follow up, and they’re the ones we tend to want to deal with. Dan says, “Following through on promises isn’t a common trait.” I’d like to disagree, but he may be right. Check it out.
Recruiting the Next Generation of PCB Designers at Garmin
Published March 6
It’s no secret that we’re running out of PCB designers and design engineers. There are open PCB design jobs around the globe, and there aren’t enough designers to fill these jobs. In this interview, Garmin’s design engineering manager, LB Yates, explains the company’s plans to recruit and train the next generation of PCB designers.
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Facing the Future: The Role of 5G and Beyond in Shaping PCB Demand
05/13/2025 | Prashant Patel -- Column: Facing the FutureInnovations that push the boundaries of connectivity shape the future of technology, processing power, and miniaturization. 5G and emerging 6G technologies are critical in transforming industries from telecommunications and healthcare to autonomous systems. This affects the printed circuit board (PCB) industry, where demand for high-performance, miniaturized, and advanced PCBs is surging. This column explores the key applications of 5G and beyond, the challenges in designing high-frequency PCBs, the effects of miniaturization, industry collaborations, and opportunities for North American companies in this space.
Accurate Circuit Engineering: Be Nimble, Quick, and Open to Change
05/12/2025 | Marcy LaRont, PCB007 MagazineJames Hofer, general manager of Accurate Circuit Engineering (ACE) in Southern California, shares his insights about his specialty, quick-turn company, the market, and the interesting times in which we find ourselves. James remains optimistic about bringing manufacturing back to the United States and takes great pride in the work that ACE does to support military, defense, and aerospace. As James looks toward a prosperous 2025, he reflects on his 40 years in the business and learning that the secret to success is not trying to be everything to everyone.
The Shaughnessy Report: Solving the Data Package Puzzle
05/12/2025 | Andy Shaughnessy -- Column: The Shaughnessy ReportIf you ask fabricators about their biggest challenges, they’ll often point at PCB designers—the readers of this magazine. Yes, you! Why is it so difficult to create the ideal data package? It’s a fairly straightforward task. But this part of the design process keeps tripping up designers, even those who started in the industry before Pink Floyd split up.
ASC Acquires Cutting-Edge High Vacuum Plugging Machine CF 200 to Expand Via Fill Capabilities
05/12/2025 | American Standard CircuitsAnaya Vardya, President and CEO of American Standard Circuits and ASC Sunstone Circuits, has announced that the company has acquired and installed a state-of-the-art ITC Intercircuit CF 200 high vacuum plugging machine at its West Chicago manufacturing facility. This latest investment further strengthens ASC’s ongoing commitment to advanced manufacturing, precision engineering, and industry-leading process automation.
New Issue of Design007 Magazine: Are Your Data Packages Less Than Ideal?
05/09/2025 | I-Connect007 Editorial TeamWhy is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal data package for your design.