Lockheed Martin's LM 400 Tech Demo to Prove Out Design and Risk Reduction Efforts
March 6, 2025 | Lockheed MartinEstimated reading time: 1 minute

The latest self-funded technology demonstration from Lockheed Martin is ready to launch no earlier than March 15.
In the weeks ahead, the LM 400 technology demonstration is planned to launch on a Firefly Aerospace Alpha rocket, which successfully passed its static fire test today. The technology demonstration arrived in California on March 1, and is now undergoing pre-launch payload processing at Astrotech Space Operations.
The satellite was specifically designed to showcase the investment in risk-reduction efforts and pathfinding Lockheed Martin has done for its mid-sized, LM 400 multi-mission satellite bus, and to demonstrate the spacecraft's operational capabilities on orbit for customers.
This launch will also be providing a valuable training opportunity for the U.S. Space Force's Space Safari Responsive Space program and the Commercial Augmentation Space Reserve (CASR) construct.
"As the need for greater resiliency and proliferated architectures grow, we've made a critical investment in this LM 400 technology demonstration to design and illustrate timely and relevant capabilities on-orbit for our customers," explained Jeff Schrader, vice president of Strategy and Business Development for Lockheed Martin Space. "We look forward to our ride with Firefly, and ultimately enhancing the technical and manufacturing readiness of the multi-orbit, multi-mission LM 400 platform."
As a platform, Lockheed Martin's LM 400 is the company's most flexible satellite bus, capable of carrying out military, commercial or civil customers' missions. It can be customized to host a variety of missions and high-power payloads – including remote sensing, communications, imaging and radar – and operates in any orbit. The LM 400 is already under contract.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).