-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
The Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
TSMC Intends to Expand Its Investment in the United States to $165 Billion to Power the Future of AI
March 4, 2025 | TSMCEstimated reading time: 1 minute
TSMC announced its intention to expand its investment in advanced semiconductor manufacturing in the United States by an additional $100 billion. Building on the company’s ongoing $65 billion investment in its advanced semiconductor manufacturing operations in Phoenix, Arizona, TSMC’s total investment in the U.S. is expected to reach US$165 billion. The expansion includes plans for three new fabrication plants, two advanced packaging facilities and a major R&D team center, solidifying this project as the largest single foreign direct investment in U.S. history.
Through this expansion, TSMC expects to create hundreds of billions of dollars in semiconductor value for AI and other cutting-edge applications. TSMC’s expanded investment is expected to support 40,000 construction jobs over the next four years and create tens of thousands of high-paying, high-tech jobs in advanced chip manufacturing and R&D. It is also expected to drive more than $200 billion of indirect economic output in Arizona and across the United States in the next decade. This move underscores TSMC’s dedication to supporting its customers, including America’s leading AI and technology innovation companies such as Apple, NVIDIA, AMD, Broadcom, and Qualcomm.
“Back in 2020, thanks to President Trump’s vision and support, we embarked on our journey of establishing advanced chip manufacturing in the United States. This vision is now a reality," said TSMC Chairman and CEO Dr. C.C. Wei. “AI is reshaping our daily lives and semiconductor technology is the foundation for new capabilities and applications. With the success of our first fab in Arizona, along with needed government support and strong customer partnerships, we intend to expand our U.S. semiconductor manufacturing investment by an additional $100 billion, bringing our total planned investment to $165 billion.”
TSMC's Arizona fab currently employs more than 3,000 people on 1,100 acres of land in Arizona. The site has been in volume production since late 2024. This expansion will play a crucial role in strengthening the U.S. semiconductor ecosystem by increasing American production of advanced semiconductor technology. It will also complete the domestic AI supply chain with TSMC’s first U.S. advanced packaging investments.
In the United States, in addition to its latest manufacturing site in Phoenix, TSMC operates a fab in Camas, Washington, and design service centers in Austin, Texas, and San Jose, California.
Suggested Items
iMAPS’ Annual Conference Opener in Phoenix ‘Blew My Mind’
03/05/2025 | Marcy LaRont, I-Connect007It was a cool and sunny morning as I headed out to the iMAPS Device Packaging Conference 2025 in Arizona early Tuesday, which featured two compelling keynote speakers, and a day chocked full of technical sessions. iMAPS 2025 also hosted a sold-out exhibit hall with 65 exhibitors from IBM and Heraeus to Cadence and KYZEN, to name just a few. The technology and packaging discussions at this conference blew my mind last year, and it is clear this year would be no different.
Alpha and Omega Semiconductor to Feature Groundbreaking Controllers for AI and Robust Packaging Advancements at APEC 2025
03/05/2025 | Alpha and Omega SemiconductorAlpha and Omega Semiconductor Limited (AOS), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules will showcase its complete line of advanced power management solutions at the Applied Power Electronics Conference (APEC).
U.S. to Hold Over 20% of Advanced Semiconductor Capacity by 2030, TSMC Expands Investment to $165B
03/05/2025 | TrendForceTrendForce’s latest findings reveal that TSMC has announced it’s increasing investment in U.S. advanced semiconductor manufacturing, bringing the total to US$165 billion.
ITW EAE Electrovert Unveils Aquastorm 160 a Compact Design that Meets Unmatched Cleaning Performance
03/04/2025 | ITW EAEElectrovert, a leader in innovative cleaning solutions, proudly announces the launch of the Aquastorm 160 (AS160), an advanced cleaning system designed to deliver superior performance with a compact footprint.
Yamaha Robotics Advanced Safety Package Eases Factory-safety Enhancement
03/04/2025 | Yamaha Robotics SMT SectionYamaha Robotics SMT Section has extended availability of the Advanced Safety Package, which contains optional features to elevate printer and mounter safety above and beyond mandatory levels.