WISE Partners with TTM Technologies for Syracuse uHDI Manufacturing Facility
March 4, 2025 | TTM Technologies, Inc.Estimated reading time: 1 minute
TTM Technologies (“TTM”) has selected WISE as a key partner and exclusive supplier of horizontal wet process machines for its new ultra-high-density interconnect (“uHDI”) PCB manufacturing facility in Syracuse, NY.
This cutting-edge facility, adjacent to TTM’s existing campus, represents a major investment in North American high-tech manufacturing. With a projected capital investment of $100-$130 million, the project will generate approximately 400 skilled jobs in manufacturing and engineering.
WISE will provide 15 advanced wet and mechanical process machines, ensuring optimized PCB production and reinforcing its long-standing partnership with TTM. WISE’s strong presence in the U.S., supported by its trusted partners Technica USA and Photo Chemical Systems, played a crucial role in this agreement.
In addition to providing state-of-the-art equipment, WISE offers outstanding support through two strategically stocked spare parts inventories in the USA territory and a team of 10 factory-trained technicians across the U.S. This strong service network ensures fast response times and dependable maintenance for TTM’s operations.
Phil Titterton, Executive Vice President and Chief Operating Officer of TTM Technologies, stated, “WISE’s expertise and strong U.S. support system make them a key partner in achieving our manufacturing goals.”
Massimo Passerini, Chief Executive Officer of WISE, added, “We are proud to contribute to TTM’s growth with our cutting-edge technology and dedicated service network.”
This partnership strengthens domestic PCB production, advancing high-tech manufacturing and reinforcing WISE’s commitment to excellence in the U.S. market.
Suggested Items
NEPCON ASIA 2025: Innovating Smart Manufacturing Ecosystems and Bridging Global Opportunities
07/11/2025 | PRNewswireTaking place from October 28 to 30, 2025 at the Shenzhen World Exhibition & Convention Center (Bao'an), NEPCON ASIA is the premier platform to discover the latest technologies and market trends, connect with new suppliers and products, and explore potential partnerships and distribution opportunities.
Mycronic Delivers Strong Q2 Performance and Raises 2025 Outlook to SEK 7.5 Billion
07/11/2025 | MycronicMycronic reported a 35% increase in Q2 net sales and a 27% EBIT margin, prompting an upward revision of its full-year 2025 revenue forecast to SEK 7.5 billion.
Cetec ERP Expands into Larger Office to Support Continued Growth
07/11/2025 | Cetec ERPCetec ERP, a leading provider of cloud-based ERP software for manufacturers, has officially relocated to a larger, modern office facility in central Austin as of July 2, 2025.
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.
Kitron Reports Strengthening Momentum in Q2 2025
07/10/2025 | KitronKitron reported solid quarterly sales and profits, particularly driven by the Defence & Aerospace market sector.