Schmoll: Decades of Technology Evolution
It’s Only Common Sense: The Danger of Overthinking
Punching Out: Fewer Than 150 PCB Shops Remain in North America
Rogers Corporation Launches New Thermoset Laminates for Automotive Radar Sensor Applications
March 3, 2025 | Rogers CorporationEstimated reading time: 1 minute
Rogers Corporation (NYSE:ROG) announced its latest innovation in dielectric materials: RO4830™ Plus Circuit Materials, which are well suited for cost-sensitive millimeter wave PCB applications, such as 76-81 GHz automotive corner radar sensors.
Electrical performance optimized for 76-81 GHz automotive radar applications
RO4830 Plus woven glass free, thermoset laminates possess the stable dielectric constant and low insertion loss required by RF designers for millimeter wave automotive radar sensors. The design dielectric constant of RO4830 Plus laminates is approximately 3.03 at 77GHz (microstrip differential phase length method). The combination of Rogers’ new low-loss thermoset resin and very low profile electrodeposited copper foil translates to a very low insertion loss of 1.5 dB/inch for 5mil laminates, as measured by the microstrip differential phase length method.
PCB fabrication characteristics reduce overall PCB manufacturing costs
RO4830 Plus laminates are engineered for the cap layer on FR-4 multi-layer board designs, which are commonly used for 76- 81 GHz automotive radar sensor PCB applications. These thermoset laminates are free of woven glass, contributing to good laser drilling performance, and CAF resistance. RO4830 Plus laminates can be fabricated using standard epoxy/glass (FR-4) processes and are compatible with RO4400™ bond ply. These PFAS-free laminates have the UL-V0 flame retardant rating and are lead free solder process compatible.
RO4830 Plus laminates provide:
- Stable dielectric constant and low insertion loss at 77GHz via Rogers’ new thermoset resin system combined with a very low profile electrodeposited copper (VLP ED).
- New woven-glass-free thermoset material maximizes fabrication yield and efficiency, further reducing the overall cost of PCBs.
Available in dielectric thicknesses of 0.005, Rogers RO4830 Plus laminates are available in standard panel sizes of 24×18 in. (610×457 mm), 24×20 in. (610×508 mm), 24×21in. (610×533 mm) with 0.5 oz. (18 µm) VLP ED.
Share on:
Suggested Items
INEMI Sessions at IPC APEX EXPO Focus is on Board Assembly and PCB & Laminates
03/12/2025 | iNEMIIf you plan to attend the upcoming IPC APEX EXPO in Anaheim, California, be sure to add the INEMI sessions to your calendar. We will have two forward-looking sessions — one on PCB and Laminates and the other on Board Assembly.
DuPont Sets the Stage for Electronics Innovation at DesignCon 2025 Expo
01/29/2025 | DuPontDuPont, a leader in advanced material solutions and technologies, proudly announces its participation at DesignCon 2025 Expo, taking place January 29 - 30 in Santa Clara, California.
BOOK EXCERPT: The Printed Circuit Designer’s Guide to... High Performance Materials, Chapter 4
01/02/2025 | I-Connect007In Chapter 4, Michael Gay discusses the two main types of copper foil used for PCB boards today: electrodeposited (ED) foil and rolled annealed (RA) foil. He also explains the pros and cons of each, and provides an update of the latest innovations in copper foil technology.
Don’t Overconstrain Your Board Materials
07/02/2024 | I-Connect007 Editorial TeamWhen we started planning May’s issue, which centers on the use of traditional laminates in certain high-frequency PCBs, we knew we had to interview Kris Moyer and Ed Kelley together. Kris teaches advanced PCB design classes for IPC, and Ed is the former CTO of Isola and founder of Four Peaks Innovation. What ensued was a wide-ranging discussion on the evolution of “standard” PCB laminates and the recent trend by some OEMs to use these materials in high-frequency and even RF boards.
Underconstraining Your Materials? Leave It to the Experts
05/30/2024 | I-Connect007 Editorial TeamWith traditional laminates now sporting improved resin systems, some OEMs are choosing various flavors of FR-4 instead of high-speed laminates for their high-speed designs—even RF applications. Avoiding overconstraining your materials in high-speed products can lead to considerable cost savings, not to mention a more streamlined trip through fabrication.