eInfochips Joins Samsung Advanced Foundry Ecosystem (SAFE™) to Drive Semiconductor Innovation
February 28, 2025 | PRNewswireEstimated reading time: Less than a minute
eInfochips, an Arrow Electronics company, announced the company has joined the Samsung Advanced Foundry Ecosystem (SAFE™) as a Virtual Design Partner.
Samsung Foundry's Virtual Design Partners offer customers a wide breadth of design services from spec to GDSII. By leveraging these capabilities, customers can easily adopt Samsung Foundry's technologies to develop custom silicon and bring advanced semiconductor solutions to market faster and more effectively.
"We are thrilled to join the Samsung Advanced Foundry Ecosystem," said Mangesh Kulkarni, vice president and general manager of semiconductor practice at eInfochips. "It reflects our deep expertise and positions us to offer an expanded range of design and testing services, utilizing Samsung's latest process technologies. eInfochips brings extensive silicon design experience and a track record of successful tape-outs across 180nm to 3nm process technologies to this ecosystem."
Suggested Items
Quest Global Acquires Alpha-Numero Technology Solutions
03/14/2025 | Quest GlobalQuest Global is pleased to announce the acquisition of Alpha-Numero Technology Solutions. Alpha-Numero is a US-based VLSI design company with expertise in FPGA.
Würth Elektronik Now an Infineon ‘Preferred Partner’
03/13/2025 | Wurth Elektronik eiSosWürth Elektronik, one of the leading manufacturers of electronic and electromechanical components, is broadening its collaboration with semiconductor manufacturers.
Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication
03/13/2025 | John Watson -- Column: Elementary, Mr. WatsonAt the 2020 Tokyo Summer Olympics, the U.S. men's 4x100-meter relay team had high hopes of winning a medal. The team comprised some of the fastest sprinters in the world, but something went wrong. In a relay, four runners must smoothly pass their baton to the next runner inside a zone on the track. If a runner drops the baton or it’s passed outside the zone, the team risks disqualification. The U.S. team’s pass between the second and third runner was messy, slowing them down. By the time the last runner received the baton, the team had lost too much time. They finished sixth in their heat and didn’t qualify for the final.
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
TI Introduces the World's Smallest MCU, Enabling Innovation in the Tiniest of Applications
03/12/2025 | PRNewswireTexas Instruments (TI) introduced the world's smallest MCU, expanding its comprehensive Arm® Cortex®-M0+ MSPM0 MCU portfolio. Measuring only 1.38mm2, about the size of a black pepper flake, the wafer chip-scale package (WCSP) for the MSPM0C1104 MCU enables designers to optimize board space in applications such as medical wearables and personal electronics, without compromising performance.