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Gold as a Key Component in PCBs and IC Substrates

03/20/2025 | Britta Schafsteller, Sandra Nelle, and Kuldip Johal, MKS' Atotech
Gold has long been a cornerstone in the electronics industry, particularly in the surface finishing of PCBs and IC substrates. It provides essential surface protection while enabling various assembling techniques, such as soldering connections and wire bonding, using aluminum, gold, or copper wires.

TSMC and MediaTek Collaboration Paves the Way for Next-gen Wireless Connectivity

03/13/2025 | TSMC
MediaTek and TSMC announced that they have jointly demonstrated the first silicon-proven power management unit (PMU) and integrated power amplifier (iPA) on TSMC’s N6RF+ process.

OMRON Partners with Wiferion for Inductive AMR Charging

02/28/2025 | Omron
Working together to increase the performance of autonomous mobile robots (AMRs) and enable new application concepts — to achieve this goal, OMRON has certified Wiferion’s wireless charging technology for the LD series robots.

Registration Open for Electrical Wire Processing Technology Expo (EWPTE) 2025

02/24/2025 | IPC
Registration is now open for the Electrical Wire Processing Technology Expo (EWPTE), to be held at Baird Center May 6-8, 2025, in Milwaukee, Wisconsin.

Incheon National University Study Pioneers Breakthrough in Wireless Charging Technology

02/21/2025 | PRNewswire
The efficiency of wireless charging systems is limited by power loss occurring due to frequency changes in the resonant circuits that enable power transfer.
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