Beyond the Board: Empowering the Next Generation of Tech Innovators in Electronics
The Government Circuit: Trump’s Trade War Disrupts the Electronics Ecosystem
Defense Speak Interpreted: Update on the Continuing Resolution and Budget Process for Defense
AIM to Highlight REL61™, W20, and Ultrafine Paste Offerings at Productronica China
February 19, 2025 | AIMEstimated reading time: Less than a minute
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming Productronica China, taking place March 26-28 at the Shanghai New International Expo Center. Among other great products, AIM will showcase its latest innovations in soldering technology, including REL61™, W20 water-soluble solder paste, and ultrafine solder paste solutions.
AIM’s REL61™ alloy, a low-cost SAC305 alternative, provides superior performance across most metrics including thermal fatigue. REL61 is lead-free and versatile – available in bar, wire, and paste.
W20 is a halogen-free, water-soluble solder paste, engineered for excellent printability, cleanability, and reduced voiding. AIM will also highlight its ultrafine solder paste solutions, designed to meet the increasing demand for miniaturization in advanced electronics manufacturing.
Share on:
Suggested Items
Koh Young Installs 24,000th Inspection System at Top 20 EMS
05/14/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at a Top 20 Global EMS in Thailand.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.