ASM Technologies Signs MoU with the Government of Karnataka
February 14, 2025 | ASM TechnologiesEstimated reading time: 1 minute
ASM Technologies Limited, a pioneer in design-led Manufacturing in the semiconductor and automotive industries, announced signing of Memorandum of Understanding (MoU) with the Government of Karnataka whereby it will invest Rs. 510 crores in the state to expand its ESDM related Design-Led Manufacturing and precision engineering capacity. As part of the agreement ASM Technologies will acquire 10 acres of land from the Karnataka Industrial Areas Development Board (KIADB) to set up a state-of-the-art design facility.
Speaking about the MoU, Rabindra Srikantan, Managing Director of ASM Technologies Limited, said, “This MoU reaffirms ASM Technologies Limited’s’ commitment to Karnataka’s industrial growth and self-reliance. This expansion will enhance our precision engineering for the electronics, semiconductor and solar industries, create employment opportunities and promote technological advancements in the region. We are grateful to the Government of Karnataka for their support and look forward to a fruitful collaboration.”
ASM Technologies also recently commenced operations from its two new state-of-the-art manufacturing facilities at Dabaspet, Karnataka and Sriperumbudur, Tamil Nadu. Totalling over 55,000 sq.ft. across both locations, the facilities are expected to give a fillip to the company’s design-led manufacturing operations and will serve as core centres of excellence for its clients across key industry verticals.
These developments mark yet another step in ASM’s pursuit of leadership in engineering innovation and its commitment to the highest degree of excellence. This also complements the Government of India’s ‘Make in India’ initiative. Through these investments, the company plans to augment its capabilities and offerings in design-led manufacturing and precision engineering while contributing to industrial progress.
Suggested Items
Summit Interconnect Welcomes Leo LaCroix as Vice President of Aerospace & Defense Operations
02/21/2025 | Summit Interconnect, Inc.Summit Interconnect, a leading provider of advanced printed circuit board (PCB) solutions, is pleased to announce that Leo LaCroix has joined the company as Vice President of Aerospace & Defense Operations. In this role, LaCroix will oversee operational strategy, customer engagement, and manufacturing excellence for Summit’s aerospace and defense-focused facilities, driving continued growth and innovation in the sector.
SEMIEXPO Heartland to Spotlight Smart Manufacturing, Smart Mobility
02/21/2025 | SEMISEMIEXPO Heartland, SEMI’s first Midwestern U.S. exposition to be held April 1-2 at the Indiana Convention Center in Indianapolis, will feature a conference program highlighting the latest developments in smart manufacturing and smart mobility.
The Test Connection Celebrates Its 45-Year Test and Training Legacy at IPC APEX EXPO 2025
02/20/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is proud to announce its participation in the 2025 IPC APEX EXPO.
BAE Systems Significantly Expands Endicott Operations to Support Aircraft Electrification
02/20/2025 | BAE SystemsBAE Systems, a leading aerospace technology company, is expanding its operations in Endicott, New York, with a 150,000 square feet addition to its existing footprint. The dedicated facility will be equipped for high-voltage energy storage systems (ESS) development, manufacturing, and field support, advancing sustainable aviation solutions.
Arch Systems to Showcase AI-Powered Automated Downtime Labeling at IPC APEX EXPO 2025
02/20/2025 | Arch SystemsArch Systems, a leader in machine data, AI, and analytics for manufacturers, will exhibit at the 2025 IPC APEX EXPO, taking place from March 18-20 at the Anaheim Convention Center in California. Visitors can explore Arch's latest innovations at Booth #1102, where the company will introduce Arch Systems’ Automated Downtime and its collaborative efforts in global electronics manufacturing.