Punching Out: Fewer Than 150 PCB Shops Remain in North America
Facing the Future: Technology Trends Shaping the PCB Market
Marcy's Musings: The Golden Touch?
3M Joins Consortium to Accelerate Semiconductor Technology in the U.S.
February 4, 2025 | PR NewswireEstimated reading time: 1 minute
3M is expanding its commitment to the semiconductor industry by joining the US-JOINT Consortium, a strategic partnership of 12 leading semiconductor suppliers. The consortium drives research and development in next-generation semiconductor advanced packaging and back-end processing technologies anchored by a new cutting-edge facility in Silicon Valley.
"As the demands of AI and other high performance computing technologies increase, suppliers must work together to provide comprehensive solutions to tough challenges on increasingly shorter timelines." said Steven Vander Louw, 3M's president of display and electronics product platforms. "The companies in the US-JOINT Consortium represent US and Japanese innovation leaders in a range of advanced packaging technologies. 3M is pleased to join the consortium in order to bring our decades of materials science expertise, across more than 50 technology platforms, to help address these challenges."For more than 25 years, 3M has been a supplier of materials and processing aids for semiconductor polishing, advanced packaging, and chip transport applications. Teaming up with industry leaders continues to reinforce 3M's commitment to be an integrated total solutions provider for the semiconductor industry.
The consortium was founded in 2023 and led by Japan-based Resonac, a global leader in the semiconductor and electronics industry.
"We are delighted to welcome 3M to the US-JOINT Consortium," said Hidenori Abe, CTO for semiconductor materials, Resonac. "3M's expertise in materials science and commitment to innovation in advanced packaging device and process solutions will be an asset as we work together to solve difficult technical and integration challenges for customers onshore in the United States."
The new US-JOINT Consortium R&D facility is expected to be unveiled later this year in conjunction with a public launch event.
Share on:
Suggested Items
ASMPT Strengthens its Global Footprint
03/21/2025 | ASMPTASMPT, the global market and technology leader for hardware and software solutions in the semiconductor and electronics industries, continues to drive the growth of its semiconductor solutions in strategically important markets.
SEMI, ESIA Rally Political Support for a European Semiconductor Strategy
03/20/2025 | SEMISeeking to explore semiconductor policy measures that can strengthen the industrial policy in the European Union, SEMI and the European Semiconductor Industry Association (ESIA) have successfully held a high-level roundtable event in the European Parliament under the auspices of Members of the European Parliament (MEPs) Bart Groothuis (Renew Europe), Oliver Schenk (European People’s Party) and Dan Nica (Socialists and Democrats Party).
Global Top 10 IC Design Houses See 49% YoY Growth in 2024, NVIDIA Commands Half the Market
03/17/2025 | TrendForceTrendForce reveals that the combined revenue of the world’s top 10 IC design houses reached approximately US$249.8 billion in 2024, marking a 49% YoY increase.
TSI Introduces the Nano LPM System for Semiconductor Ultrapure Water Nanoparticle Detection
03/14/2025 | TSI IncorporatedTSI Incorporated, a global leader in precision measurement and data-driven solutions, announces the introduction of the new TSI Nano LPM™ System, marking a breakthrough in ultrapure water (UPW) monitoring for the semiconductor industry, and solving the problem of detecting particles down to a level that has never been done before.
Ainos, ASE Partner to Power AI Scent Digitization in Semiconductor Manufacturing
03/14/2025 | ASE GroupAinos, Inc., a leader in AI-driven scent digitization, has announced a strategic collaboration with Advanced Semiconductor Engineering, Inc. (ASE), the world’s largest provider of semiconductor packaging and testing services.