Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "

Brent Fischthal - Koh Young

Suggested Items

SEMI Appoints Julie Rogers Executive Director of the ESD Alliance

05/01/2026 | SEMI
SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, announced the appointment of Julie Rogers as Executive Director of the Electronic System Design Alliance (ESDA), a SEMI Technology Community.

SEMI ESD Alliance 2026 Outlook: Agentic AI to Transform Chip Design and Verification

05/01/2026 | SEMI
The Electronic System Design Alliance (ESD Alliance), a SEMI Technology Community, announced its annual Executive Outlook event for semiconductor EDA, agentic AI and IP company executives.

Teradyne Reports New Record High in Q1 2026

04/30/2026 | BUSINESS WIRE
Teradyne, Inc. reported revenue of $1,282 million for the first quarter of 2026 of which $1,111 million was in Semiconductor Test, $91 million in Robotics, and $80 million in Product Test. GAAP net income for the first quarter of 2026 was $398.9 million, or $2.53 per diluted share.

SEMI Reports 13% Year-on-Year Growth in Global Silicon Wafer Shipments in Q1 2026

04/30/2026 | SEMI
The SEMI Silicon Manufacturers Group (SMG) reported, in its quarterly analysis of the silicon wafer industry, that worldwide silicon wafer shipments increased 13.1% year-on-year to 3,275 million square inches (MSI) from the 2,896 MSI recorded during the same quarter of 2025.

SCHMID Launches 'Any Layer ET' for Panel-Level Advances Packaging, to Present at ECTC 2026

04/30/2026 | SCHMID Group
SCHMID Group, a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, is advancing next-generation substrate manufacturing with its proprietary Any Layer ET (Embedded Trace) Process for full panel-level Advanced Packaging.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in