Global Citizenship: Redefining Connection and Responsibility in Digital Transformation
SMT Perspectives and Prospects: Artificial Intelligence, Part 5: Brain, Mind, Intelligence
Global Sourcing Spotlight: Watch Out! Avoiding Pitfalls in Global Sourcing
The Future of Electronics Manufacturing in APAC
January 30, 2025 | Daniel Schmidt, MKS' ATOTECHEstimated reading time: 1 minute
The Asia-Pacific (APAC) region is solidifying its leadership in electronics manufacturing, fueled by significant new investments from global industry leaders. This growth is driven by surging demand for high-performance components in key sectors like AI, autonomous vehicles, and sustainable energy, making strategic innovation in semiconductors and advanced electronics essential. APAC's strong supply chains further enhance its appeal to investors.
Transforming Electronics Manufacturing
The electronics industry's shift to 3D heterogeneous integration—assembling chips on organic substrates—is driving demand for new materials, processes, and technologies. This innovation, combined with the industry's increasing presence in APAC, leverages the region's robust manufacturing capabilities and investment opportunities, positioning it for substantial growth.
Meeting the Challenges of Advanced Technologies
The rise of AI, renewable energy systems, and autonomous vehicles has created a demand for components that are faster, smaller, and capable of handling immense data loads. Essential for miniaturization and high-speed applications, next-generation technologies using electrochemical deposition for advanced semiconductor packaging, semi-additive processing (SAP) for package substrates, or modified SAP (mSAP) at the printed circuit board level enable the much finer feature sizes required for increased density and fast signaling. In addition, advanced materials such as glass substrates are contributing to this trend, enabling finer feature sizes with improved signal integrity, which is critical for high-performance systems.
Read the rest of this article in the January 2025 issue of PCB007 Magazine.
Share on:
Suggested Items
Spirit Electronics Expands U.S. Semiconductor Capacity with Acquisition of SMART Microsystems
04/17/2025 | BUSINESS WIREAs part of its strategic commitment to strengthening domestic semiconductor manufacturing, Spirit Electronics has acquired SMART Microsystems, located at Lorain County Community College (LCCC) in Ohio.
Nortech Expands Fiber Optic Capabilities to Include MT Connectors, Strengthening Aerospace and Defense Solutions
04/16/2025 | BUSINESS WIRENortech Systems, a trusted leader in innovative connectivity solutions, announced an exciting expansion in its fiber optic capabilities with the integration of MT connectors. MT connectors, known for their ability to support multiple fiber terminations in a compact form factor, are an ideal choice for applications requiring robust data transmission and reliability.
ASMC 2025 Showcases AI and Emerging Technologies Shaping the Future of Semiconductor Manufacturing
04/16/2025 | SEMIThe 36th annual Advanced Semiconductor Manufacturing Conference (ASMC) 2025 will be held May 5-8, 2025, in Albany, New York, bringing together leaders in semiconductor manufacturing to explore cutting-edge advancements driving high-volume production and AI-powered innovation.
ASMC 2025 Showcases AI and Emerging Technologies Shaping the Future of Semiconductor Manufacturing
04/15/2025 | SEMIThe 36th annual Advanced Semiconductor Manufacturing Conference (ASMC) 2025 will be held May 5-8, 2025, in Albany, New York, bringing together leaders in semiconductor manufacturing to explore cutting-edge advancements driving high-volume production and AI-powered innovation.
Saki’s AXI Upgrade Enhances Image Noise Reduction for Power Modules, Enabling Sharper, More Accurate Inspections
04/11/2025 | Saki CorporationSaki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, announces significant enhancements to the image processing capabilities of its 3Xi-M200 X-ray Automated Inspection (AXI) system.