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January 29, 2025 | DuPontEstimated reading time: 1 minute
DuPont, a leader in advanced material solutions and technologies, proudly announces its participation at DesignCon 2025 Expo, taking place January 29 - 30 in Santa Clara, California. This premier conference attracts System, Board, and Chip manufacturing professionals seeking innovative materials and technologies. DuPont will showcase its extensive portfolio of electronics solutions featuring Pyralux® flex circuit laminates and adhesive systems and Kapton® polyimide films at booth #502.
DuPont’s trailblazing films and flex circuit materials are specifically engineered to enhance signal integrity and thermal performance for critical applications like AI printed circuit boards, 5G networks, EVs, and consumer electronics. The Pyralux® portfolio features flexible copper clad laminates, coverlays, and adhesives with low dissipation factors, specifically designed for high-speed applications. These products not only excel under high-service temperatures but maintain their integrity in extreme conditions when paired with the resilient Kapton® films.
DuPont will also introduce the latest generation of Pyralux® flex circuit coverlays, which provide enhanced dimensional stability, low-ion migration, and high-speed, high-frequency properties essential for cutting-edge devices.
"DesignCon 2025 is the perfect stage for DuPont to showcase our relentless pursuit of innovation in the films and laminates arena," said Anthony Rardin, Commercial Leader, Laminates West, DuPont. "We are eager to connect with key industry stakeholders, partners, and customers to uncover how our cutting-edge solutions can tackle their most daunting challenges."
Attendees can visit DuPont’s booth to see a variety of displays including a model of the Mars Perseverance Rover and a cell phone teardown station. Experience live product demonstrations and consult with our experts to discover how DuPont can be your trusted partner in advancing innovation and driving technology forward.
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