Flexible Thinking Flexible Circuit Technology—Looking Back and Forward
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBs
DuPont Sets the Stage for Electronics Innovation at DesignCon 2025 Expo
January 29, 2025 | DuPontEstimated reading time: 1 minute
DuPont, a leader in advanced material solutions and technologies, proudly announces its participation at DesignCon 2025 Expo, taking place January 29 - 30 in Santa Clara, California. This premier conference attracts System, Board, and Chip manufacturing professionals seeking innovative materials and technologies. DuPont will showcase its extensive portfolio of electronics solutions featuring Pyralux® flex circuit laminates and adhesive systems and Kapton® polyimide films at booth #502.
DuPont’s trailblazing films and flex circuit materials are specifically engineered to enhance signal integrity and thermal performance for critical applications like AI printed circuit boards, 5G networks, EVs, and consumer electronics. The Pyralux® portfolio features flexible copper clad laminates, coverlays, and adhesives with low dissipation factors, specifically designed for high-speed applications. These products not only excel under high-service temperatures but maintain their integrity in extreme conditions when paired with the resilient Kapton® films.
DuPont will also introduce the latest generation of Pyralux® flex circuit coverlays, which provide enhanced dimensional stability, low-ion migration, and high-speed, high-frequency properties essential for cutting-edge devices.
"DesignCon 2025 is the perfect stage for DuPont to showcase our relentless pursuit of innovation in the films and laminates arena," said Anthony Rardin, Commercial Leader, Laminates West, DuPont. "We are eager to connect with key industry stakeholders, partners, and customers to uncover how our cutting-edge solutions can tackle their most daunting challenges."
Attendees can visit DuPont’s booth to see a variety of displays including a model of the Mars Perseverance Rover and a cell phone teardown station. Experience live product demonstrations and consult with our experts to discover how DuPont can be your trusted partner in advancing innovation and driving technology forward.
Share on:
Suggested Items
Empowering the Future of Advanced Computing and Connectivity: DuPont Unveils Innovative Advanced Circuit Materials in Shanghai
03/24/2025 | DuPontDuPont will showcase how we are shaping the next generation of electronics at the International Electronic Circuits (Shanghai) Exhibition 2025.
DuPont Interconnect Materials Enabling Advancements in Aerospace & Defense, Next-Gen Automotive, and AI
03/19/2025 | DuPontDuPont Interconnect Solutions (ICS)—a leading material solutions and systems design partner within DuPont Electronics & Industrial that addresses signal integrity and power and thermal management challenges—will showcase the benefits of its materials for printed circuit board (PCB) manufacturing and electronics assembly at IPC APEX Expo.
DuPont Announces CEO and Non-Executive Chair for the Planned Independent Electronics Company
03/17/2025 | DuPontDuPont announced Jon Kemp, President, DuPont Electronics & Industrial will be the Chief Executive Officer and a member of the board of directors for the future independent Electronics public company that will be created following its intended spin-off from DuPont.
DuPont’s Ellen Mager Recognized as 2025 Women MAKE Award Honoree
03/10/2025 | DuPontDuPont proudly announced that Ellen Mager, Site Leader at the DuPont New England Manufacturing & Technology Center (NEMTC) in Marlborough, Mass., has been honored as a recipient of the Manufacturing Institute’s Women MAKE Award.
DuPont Appoints Kurt McMaken to Board of Directors
02/25/2025 | DuPontDuPont announced the appointment of Kurt McMaken to its Board of Directors, effective immediately. Mr. McMaken will serve on the Audit committee and Nomination and Governance committee.