EDA Tools and the Designer of the Future
January 28, 2025 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 1 minute

We’re seeing new, young technologists moving into the PCB design and design engineering segment, and it’s just in time; many veteran designers are headed to retirement.
At the same time, there have been various recent advances in EDA tools. What will the PCB designer’s job—and the designer’s software tools—look like in the next five years?
Bob Potock, vice president of marketing for Zuken USA, weighs in on the PCB designers of tomorrow, and the EDA tools that will take them into an evermore complex future.
Andy Shaughnessy: I imagine Zuken has a “profile” of its typical user. How do you see this their job and its requirements evolving over the next few years?
Bob Potock: At Zuken, we believe that the PCB design and layout market is evolving. Today’s tools are mature, powerful, and easy to use. However, what's changing in the design process is how the tools are used and by whom. The standard hand-off from the design engineer to the PCB layout designer is becoming a thing of the past. A board with average complexity is more commonly designed, placed, and routed by the same individual: the hardware engineer. The modern hardware engineer will be an electrical engineer who can learn how to do PCB layout on the job. Moderately complex board designs now and in the future will see the traditional PCB layout function moving to the hardware engineer.
The high-complexity PCB market is different. The tools are more powerful, and the designs have more critical requirements. IC packaging may become part of the PCB layout activity at this complexity level. The traditional design engineer hand-off to the PCB layout designer may still exist. However, this modern PCB layout designer is an electrical engineer with training in power integrity, signal integrity, manufacturing, and IC packaging.
To read this entire conversation, which appeared in the January 2025 issue of Design007 Magazine, click here.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
Global Citizenship: Together for a Perfect PCB Solution
09/10/2025 | Tom Yang -- Column: Global CitizenshipIf there’s one thing we’ve learned in the past few decades of electronics evolution, it’s that no region has a monopoly on excellence. Whether it’s materials science breakthroughs in Europe, manufacturing efficiencies in China, or design innovations in Silicon Valley, the PCB industry thrives on collaboration.
The Shaughnessy Report: Winning the Signal Integrity Battle
09/09/2025 | Andy Shaughnessy -- Column: The Shaughnessy ReportWhen I first started covering this industry in 1999, signal integrity was the hip new thing in PCB design. Conference classes on signal integrity were packed to the walls, and an SI article was guaranteed to get a lot of reads.
Machvision Leads Shift to Automated Inline Final Inspection, AOI in North America
09/10/2025 | Ralph Jacobo, all4-PCBSchweitzer Engineering Laboratories (SEL) chose Machvision inspection equipment due to its capabilities and versatility. Machvision of Taiwan offers circuit inspection, hole inspection and measurement, IC Substrate and HDI inspection, and final visual inspection solutions. The best fit for SEL was the 4.0Pro Circuit Inspection for inner and outer layers, and the AFI6 for final visual inspection of finished panels.
Elephantech Selected for NEDO’s Deep-Tech Startups Support Program in the Green Transformation field
09/09/2025 | ElephantechElephantech is pleased to announce its selection for the Demonstration development for Mass Production (DMP) phase of the 4th round of the Deep-Tech Startups Support Program in the Green Transformation field (GX) by NEDO, the New Energy and Industrial Technology Development Organization of Japan.