Global Sourcing Spotlight: How Global Sourcing Drives Innovation
One World, One Industry: IPC APEX EXPO 2025 Marks a Special Anniversary Year
KYZEN to Feature MICRONOX MX2123 Power Module Cleaner at iMAPS Wire Bonding Workshop
January 22, 2025 | KYZEN'Estimated reading time: 1 minute
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the International Symposium on Microelectronics (iMAPS) Wire Bonding 2025 Workshop and Tabletop Exhibition, scheduled to take place February 3-4 at the Westin San Diego Bayview. The KYZEN clean team will showcase multi-process power module cleaner MICRONOX MX2123 during the event.
With the continued rise in demand for high-performance advanced packaging devices, KYZEN remains dedicated to providing cleaning chemistries like MICRONOX MX2123 and process optimization services to meet the array of challenges faced by manufacturers.
MICRONOX MX2123 is a balanced, multi-phase chemistry designed to remove flux residues from a wide range of IGBT module devices that utilize combinations of copper, silver and nickel DBC as substrates. It can also remove fluxes from PCBs. MX2123 can remove slight metal oxidation from base metals for post wire bond and potting processes, leaving exceptional surface conditions after cleaning. It is effective at low temperatures, in low concentrations, and is easily monitored in in-line SIA or Ultrasonic Immersion cleaning systems.
The iMAPS Wire Bonding 2025 Workshop and Tabletop Exhibition is an advanced technical workshop presenting a unique forum to unite scientists, engineers, manufacturing, academia and others working in Wire Bonding. The workshop was established to provide a platform for presentations and debate regarding the latest technologies and applications of Wire Bonding use in battery pack, semiconductor, and microelectronic packaging.
Share on:
Suggested Items
TSMC and MediaTek Collaboration Paves the Way for Next-gen Wireless Connectivity
03/13/2025 | TSMCMediaTek and TSMC announced that they have jointly demonstrated the first silicon-proven power management unit (PMU) and integrated power amplifier (iPA) on TSMC’s N6RF+ process.
OMRON Partners with Wiferion for Inductive AMR Charging
02/28/2025 | OmronWorking together to increase the performance of autonomous mobile robots (AMRs) and enable new application concepts — to achieve this goal, OMRON has certified Wiferion’s wireless charging technology for the LD series robots.
Electrical Wire Processing Technology Expo Named in Trade Show Executive’s Top 100 List of Fastest Growing Shows of 2024
02/27/2025 | IPCIPC/WHMA and Baird Center announce that for the second consecutive year, Electrical Wire Processing Technology Expo (EWPTE) has been recognized as a top 100 fastest growing show in the United States for net square footage and number of exhibiting companies by Trade Show Executive.
Registration Open for Electrical Wire Processing Technology Expo (EWPTE) 2025
02/24/2025 | IPCRegistration is now open for the Electrical Wire Processing Technology Expo (EWPTE), to be held at Baird Center May 6-8, 2025, in Milwaukee, Wisconsin.
Incheon National University Study Pioneers Breakthrough in Wireless Charging Technology
02/21/2025 | PRNewswireThe efficiency of wireless charging systems is limited by power loss occurring due to frequency changes in the resonant circuits that enable power transfer.