Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
January 22, 2025 | Cadence Design SystemsEstimated reading time: 3 minutes
Cadence announced it has entered into a definitive agreement to acquire Secure-IC, a leading embedded security IP platform provider. The addition of Secure-IC’s talent and highly complementary, proven portfolio of embedded security IP, security solutions, security evaluation tools and services will augment Cadence’s rapidly expanding portfolio of leading-edge, silicon-proven IP, including interface, memory, AI/ML and DSP solutions.
“In our increasingly interconnected world, every semiconductor, chiplet and electronic system will require embedded security. Whether for consumer, data center, automotive, drone, robotics, or aerospace and defense applications, security is a foundational element of any design,” said Boyd Phelps, senior vice president and general manager of the Silicon Solutions Group at Cadence. “We continue to invest in our comprehensive IP and design services portfolio to provide more complete system solutions for our customers. The anticipated addition of Secure-IC’s proven embedded security IP and solutions is yet another example of our commitment to being our customers’ SoC design partner and delivering optimal value as they navigate the complexities of bringing AI-enabled SoCs and disaggregated designs to market faster and with greater impact.”
“Over the past 15 years, Secure-IC has been dedicated to safeguarding the digital future with cutting-edge technologies, multi-certified and compliant to worldwide cybersecurity regulations, that protect assets from manufacturing phases to mission mode and enable data protection at rest, in transmission and in computation. By joining Cadence, we will secure the sustainability and operational strength necessary to continue our mission while creating a powerful synergy that accelerates innovation. Together, we are poised to scale globally, deliver enhanced value to our customers and pioneer the next generation of embedded cybersecurity solutions for complex silicon systems and chiplets following the closing of the transaction,” said Hassan Triqui, co-founder and CEO of Secure-IC.
Secure-IC’s customer base includes top-tier customers such as SK Hynix Memory Solutions America, Synaptics, Silicon Labs and Faraday Technology, which span key verticals worldwide, including automotive, data center, mobile, aerospace and defense, mobile, networking, IoT and consumer electronics. This will offer reciprocal synergistic go-to-market opportunities with Cadence’s existing IP offerings, from protocol controllers and AI accelerators to supporting customers utilizing various processor architectures.
Cadence technologies, coupled with Secure-IC’s security solutions, will be fully equipped to address the growing complexities of embedded cybersecurity, ensuring robust solutions for the ever-evolving challenges of connected systems. Secure-IC has consistently delivered comprehensive security solutions to partners and customers across industries, completing over 500 successful projects worldwide. This acquisition will combine Cadence’s decades of expertise in IP and subsystem design with Secure-IC’s leading embedded cybersecurity solutions, ensuring Cadence is better able to meet the needs of its customers in the evolving world of SoCs.
For Secure-IC’s customers, this alignment will enhance global reach, ensuring long-term stability and accelerating roadmap execution while maintaining the highest standards of support and quality. The integration of Secure-IC’s complementary solutions (Securyzr™ , Laboryzr™ and Expertyzr™ ) into Cadence’s portfolio will empower Cadence to accelerate innovation, broaden its capabilities and strengthen support for diverse industries and businesses. Cadence solutions will feature comprehensive end-to-end integrated security, easily provisionable, deployable and versatile to customer use cases.
Secure-IC’s addition to Cadence expertise will be especially impactful in the context of chiplet systems and complex silicon solutions, building on the companies’ proven success together in the flagship chiplet project recently unveiled by Cadence.
Headquartered in Rennes, France, Secure-IC has eight additional offices and research centers worldwide.
The transaction is expected to close in the first half of 2025, subject to receipt of regulatory approvals and other customary closing conditions. The acquisition is expected to be immaterial to revenue and earnings this year.
Suggested Items
MKS’ Atotech and ESI Participate in CPCA Show 2025
03/25/2025 | AtotechMKS Instruments, Inc., a global provider of enabling technologies that transform our world, today announced that its strategic brands ESI (laser systems) and Atotech (process chemicals, equipment, software, and services) will showcase their latest range of leading manufacturing solutions for printed circuit board (PCB) and package substrate manufacturing at CPCA Show being held at National Exhibition and Convention Center from March 24-26, 2025.
Dr. Thomas Marktscheffel of ASMPT Honored for his Work on Open Interfaces
03/25/2025 | ASMPTDr. Thomas Marktscheffel, Director Product Management Software Solutions at ASMPT, was honored by the IPC at this year's IPC APEX EXPO in Anaheim, California, for his many years of commitment to the organization. The non-proprietary interface standards he helped develop form the basis for ASMPT’s intelligent factory concept.
Empowering the Future of Advanced Computing and Connectivity: DuPont Unveils Innovative Advanced Circuit Materials in Shanghai
03/24/2025 | DuPontDuPont will showcase how we are shaping the next generation of electronics at the International Electronic Circuits (Shanghai) Exhibition 2025.
Revitalised ViTrox Shenzhen Demo Center: A Hub for Innovation and Engagement
03/24/2025 | ViTroxViTrox, which aims to be the World’s Most Trusted Technology Company for innovative, advanced, and cost-effective Machine Vision Inspection Solutions, is excited to announce the reopening of its newly upgraded Demo Center in Shenzhen, China.
ASMPT at the Optical Fiber Communication Conference and Exposition (OFC)
03/24/2025 | ASMPTASMPT, the world’s leading provider of pioneering solutions for advanced packaging and semiconductor assembly, will present its pioneering AMICRA NANO, AMICRA NOVA PRO and MEGA bonding solutions at the ASMPT booth 5675 during the OFC 2025 trade event being held April 1-3 at the Moscone Center in San Francisco, California (USA).