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Ventec Presents Cutting Edge Innovations and High-performance Formulas at IPC APEX EXPO 2025

03/14/2025 | Ventec International Group
Ventec International Group is presenting new substrate materials and proven formulas for high-performance PCBs at IPC APEX Expo 2025, alongside the latest advances in manufacturing equipment from Ventec Giga Solutions.

Aismalibar to Showcase Advanced Thermal Management Solutions at APEC 2025

03/13/2025 | Aismalibar
Aismalibar, a global leader in high-performance thermal management materials, is set to exhibit at APEC 2025 (Applied Power Electronics Conference) in Atlanta, Georgia, from March 16–20, 2025. As the premier event for power electronics professionals, APEC provides a crucial platform for industry leaders to explore the latest advancements in thermal interface materials (TIMs), high-performance PCB laminates, and insulated metal substrates (IMS).

Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI

03/12/2025 | Ventec International Group
Ventec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.

Indium Experts to Present on Solder and Thermal Solutions at APEX 2025

03/07/2025 | Indium Corporation
As a global supplier of solder and thermal interface material (TIM) products, Indium Corporation experts are proud to share their technical insight and knowledge on a variety of industry-related topics at IPC APEX Expo, March 18-20 in Anaheim, California.

Akrometrix LLC Reports a Record Year of Revenue for 2024

03/04/2025 | Akrometrix LLC
Akrometrix, the global leader in Thermal Warpage Metrology, announces financial results for the full year 2024.
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