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Specially Developed for Laser Plastic Welding: Thermography with TherMoPro Opens New Possibilities

06/25/2025 | LPKF
LPKF introduces TherMoPro, a thermographic analysis system specifically developed for laser plastic welding that transforms thermal data into concrete actionable insights. Through automated capture, evaluation, and interpretation of surface temperature patterns immediately after welding, the system provides unprecedented process transparency that correlates with product joining quality and long-term product stability.

Day 2: More Cutting-edge Insights at the EIPC Summer Conference

06/18/2025 | Pete Starkey, I-Connect007
The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.

Ventec Strengthens Commitment to Halogen-Free PCB Manufacturing in Europe

06/11/2025 | Ventec International Group
Ventec International Group, the PCB materials innovator, manufacturer, supplier and one-stop shop for copper clad laminates, prepregs, as well as process consumables and PCB manufacturing equipment has established volume inventory of halogen-free FR4.1 and FR15.1 PCB materials at its European hub in Germany.

GEN3 Set to Host HATS²™ Technical Day at A.W. Technical Centre with Bob Neves

06/09/2025 | Gen3
GEN3, a global leader in reliability testing and measurement solutions for the electronics industry, is excited to announce a dedicated HATS²™ Technical Day to be held at the A.W. Technical Centre in Farnborough, GEN3’s HQ. The event will showcase the HATS²™ (Highly Accelerated Thermal Shock) system with demos and presentations by Bob Neves, Chairman of RAS Inc. and creator of the HATS²™.

Rehm Thermal Systems Mexico: Ten Years of Growth and Innovation in an Emerging Market

06/03/2025 | Rehm Thermal Systems
Over ten years ago, Luis A. Garcia began his success story at Rehm Thermal Systems. On May 15, 2013, he initially joined as a member of the Rehm USA team.
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