I-Connect007 Editor's Choice: Five Must-Reads for the Week
January 17, 2025 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes

Ah, January! The season of new beginnings, new goals, and the annual company meeting, where all the initiatives and objectives that survived the end-of-year planning and budgeting process are launched. Such as the case for our IPC team this week as we gathered in Chicago for some games, some inspiration, and, most definitely, some goal setting.
We’re even more committed to being your best source for industry news and tips and tricks of the trade. To that end, I’m sharing my favorite news items of the week. They range from reports on quarterly earnings to Dan Feinberg’s coverage of CES and some harsh reality from marketing expert Dan Beaulieu. If you missed it on Monday, be sure to read it again here. It’s well worth your time.
Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024
January 15
System design continues to move to the forefront of all the design methodologies. No longer can we design in “silos of discipline,” but human collaboration and design data sharing continue to integrate. The ESD Alliance, a SEMI Technology Community tracking this space, announced in its latest Electronic Design Market Data (EDMD) report that, among the data included, the four-quarter moving average, which compares the most recent four quarters to the prior four, rose 13.7%. This is a good read for those who follow the design tools market.
Fein-Lines: CES 2025—Highlighting the Future With Sony and NVIDIA
January 14
Dan Feinberg, our resident expert on CES, reports in with his review of the show’s most significant announcements. In these announcements, the industry’s biggest players showcase their key strategic objectives for 2025, inevitably with a trickle-down effect on PCB manufacturing. Dan’s coverage of CES is not to be missed.
Global PCB Connections: The Future of HDI PCBs
January 16
In this column this month, Jerome Larez takes a long look at high density interconnect (HDI). While HDI techniques have been available for quite some time, HDI is steadily moving down the adoption curve from “bleeding edge” to “early and late majority” status. HDI is increasingly a requirement for our customers. Whatever your role in electronics manufacturing, you can benefit from understanding what HDI entails. Give Jerome’s column a read; he does a good job making it clear.
TI Launches New Edge AI-enabled Radar Sensor and Automotive Audio Processors
January 10
Responding to the combination of factors of increased vehicle safety and more immersive rider experiences, Texas Instruments have developed a new line of sensors and electronics components for the automotive market. As stated in the press release, the demand for added capability and value is up and down the vehicle portfolio, from luxury to economy models. Read more here.
It’s Only Common Sense It’s Not the Market’s Fault—Take Responsibility for Your Business
January 13
Long-time columnist Dan Beaulieu pulls no punches in this column, launching with this: “Stop blaming the market and start looking in the mirror. Success doesn’t happen by chance; failure isn’t simply bad luck. It’s about owning your decisions, adapting to change, and focusing on what you can control. If you want to survive and thrive, it’s time to take responsibility for your business.”
Now that we’ve all had our planning sessions and our annual kickoff meetings, check your progress against the points Dan makes in his column.
Suggested Items
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.
Meet the Author Podcast: Martyn Gaudion Unpacks the Secrets of High-Speed PCB Design
07/10/2025 | I-Connect007In this special Meet the Author episode of the On the Line with… podcast, Nolan Johnson sits down with Martyn Gaudion, signal integrity expert, managing director of Polar Instruments, and three-time author in I-Connect007’s popular The Printed Circuit Designer’s Guide to... series.
Showing Some Constraint: Design007 Magazine July 2025
07/10/2025 | I-Connect007 Editorial TeamA robust design constraint strategy balances dozens of electrical and manufacturing trade-offs. This month, we focus on design constraints—the requirements, challenges, and best practices for setting up the right constraint strategy.
Elementary, Mr. Watson: Rein in Your Design Constraints
07/10/2025 | John Watson -- Column: Elementary, Mr. WatsonI remember the long hours spent at the light table, carefully laying down black tape to shape each trace, cutting and aligning pads with surgical precision on sheets of Mylar. I often went home with nicks on my fingers from the X-Acto knives and bits of tape all over me. It was as much an art form as it was an engineering task—tactile and methodical, requiring the patience of a sculptor. A lot has changed in PCB design over the years.
TTCI Joins Printed Circuit Engineering Association to Strengthen Design-to-Test Collaboration and Workforce Development
07/09/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is proud to announce its membership in the Printed Circuit Engineering Association (PCEA), further expanding the company’s efforts to support cross-functional collaboration, industry standards, and technical education in the printed circuit design and manufacturing community.