Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"

Rachael Temple - Alltemated

Suggested Items

Cellular IoT Module Revenues Grew 19% to $5.6B in 2025

06/26/2026 | Berg Insight
According to a new research report from the IoT analyst firm Berg Insight, annual shipments of cellular IoT modules amounted to 612 million units in 2025, up 33 percent from the previous year. Annual sales increased by 19 percent to US$ 5.6 billion in the year.

Protecting Advanced Trucking Electronics in Harsh Environments

05/13/2026 | Beth Massey, MacDermid Alpha Electronics Solutions
For decades, trucking was defined by horsepower, payload, and driver endurance. Today, the competitive edge lies in electronics, as advanced sensing, communications, and data processing systems reshape how commercial vehicles operate. The industry is rapidly digitizing, with electronic systems now critical to safety, uptime, and fleet efficiency. Technologies like ADAS, radar, lidar, and telematics enable real-time decision-making, while distributed sensors monitor key vehicle functions. Because these systems operate in harsh conditions, environmental protection using potting, coatings, and encapsulation is now a core design priority.

Global Direct-to-Cell Market to Grow 49% YoY in 2026, Unlocking New Supply Chain Opportunities

04/27/2026 | TrendForce
Direct-to-Cell technology is rapidly maturing as global mobile communications standards 3GPP Release 17 and Release 18 continue to incorporate satellite communications.

Alpha and Omega Semiconductor Begins IPM5 Production at Kaynes Semicon Launch in Gujarat

04/16/2026 | Alpha and Omega Semiconductor Limited
Alpha and Omega Semiconductor Limited, a designer, developer, and global supplier of a broad range of discrete power devices, wide bandgap power devices, power management ICs, and modules, marks a historic expansion of its global manufacturing footprint with the official inauguration of Kaynes Semicon’s state-of-the-art OSAT facility in Sanand, Gujarat.

Applications, Challenges, and the Future of Flex–Packaging Integration, Part 2

04/16/2026 | Anaya Vardya, American Standard Circuits
In the second of this two-part series, Anaya Vardya of American Standard Circuits examines applications, challenges, manufacturing considerations, and future trends emerging from the convergence of flexible printed circuit boards and advanced semiconductor packaging. Applications driving the convergence include consumer electronics, automotive systems, medical, wearables, aerospace and more.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in