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Plexus Marks Zero Waste Day with Significant Reductions in Electronic Waste

03/28/2025 | Plexus
The global surge in electronic waste, increasing by 82% since 2010 and projected to reach a staggering 82 million tons by 2030, demands immediate and effective action. In response, Plexus Corp., is demonstrating its commitment to sustainability by achieving significant waste reduction milestones at its European facilities.

KYZEN to Highlight Stencil and Cleaning Solutions at SMTA Monterrey

03/27/2025 | KYZEN'
KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Monterrey Expo & Tech Forum scheduled to take place on Thursday, April 10 at the Cintermex Convention Center in Monterrey, Nuevo León. KYZEN cleaning experts will be on-site highlighting stencil cleaning chemistries KYZEN E5631J and CYBERSOLV C8882.

Indium to Showcase Proven EV Products and High-Reliability Alloys at Productronica China

03/26/2025 | Indium Corporation
As a global materials supplier and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, Indium Corporation® is proud to showcase its high-reliability alloys and soldering solutions at Productronica China, March 26-28, in Shanghai, China.

Queen's University Belfast Enhances RF Research with LPKF ProtoLaser R4

03/26/2025 | LPKF
The Centre for Wireless Innovation (CWI) at Queen's University Belfast relies on the state-of-the-art LPKF ProtoLaser R4 to conduct RF research with high-precision structuring of sensitive materials.

Electroninks' MOD and iSAP Game Changers

03/25/2025 | Marcy LaRont, PCB007 Magazine
Electroninks, a prominent player in particle-free conductive inks, recently announced an exciting new range of metal-complex inks for ultra high density interconnect (UHDI) technology. At the SMTA UHDI Symposium in January, Mike Vinson, COO of Electroninks, gave a presentation on this line of MOD inks, which are versatile and suitable for a range of applications that require ultra-dense, miniaturized, and high-frequency technology. Mike says his technology is a game changer and will revolutionize UHDI circuit fabrication. 
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