BOOK EXCERPT: The Printed Circuit Assembler's Guide to... Encapsulating Sustainability for Electronics, Chapter 4
December 31, 2024 | I-Connect007Estimated reading time: 1 minute

The Printed Circuit Assembler's Guide to... Encapsulating Sustainability for Electronics, by Beth Turner, MacDermid Alpha Electronics Solutions
Chapter 4: Sustainability
I like to think that anyone considering using encapsulation resins to ruggedize electronics is contributing in some way towards sustainability targets. The thing all ruggedizing materials have in common is that they work to extend the lifetime and improve performance; surely that ensures fewer defects, fewer recalls and ultimately less waste? When it comes to encapsulation resins, we can do better than that, and the future looks both optimistic and exciting.
Bio-based Supply Chain
Many of the traditional raw material feedstocks for encapsulation resins rely on the use of fossil fuels. Today, there are a plethora of opportunities within this supply chain to source bio-based raw materials. Bio-based materials are completely or partially derived from living organisms, for example crops. As they come from renewable resources, bio-based products can help reduce CO2 emissions and offer other advantages such as lower toxicity. Ultimately, reducing supply chain reliance from fossil fuels towards bio-based renewable feedstocks could be one way of helping to reduce the impact of climate change. It is possible, and easy, to procure bio-based epoxy resins, modifiers, and cure agents. There are a huge number of opportunities to source bio-based polyols, crosslinkers, as well as modifiers. The emergence of bio-based additives for use with these cross-linking chemistries is also on the rise. Companies often use regulated certification systems to ensure sustainability within the supply chain; one example is the ISCC plus certification scheme that aims to prove no deforestation has occurred to produce the biomaterial.
From my experience, there is a general concern that bio-based materials must have some compromise when it comes to performance.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Armstrong Asia Signs MOU with Checkmate Capital Group to Explore Strategic Collaboration
09/15/2025 | GlobeNewswireArmstrong Asia, a leading Singapore-based manufacturer of flexible material solutions with 16 factories across 7 countries in Asia, has signed a Memorandum of Understanding (MOU) with Checkmate Capital Group, LLC (“Checkmate Capital”), a U.S.-based investment and advisory firm active in the Asia-Pacific and North American regions, focused on cross-border transactions in the life sciences, medical technology, and other industries.
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.
Jeh Aerospace Raises $11M to Boost Aircraft Supply Chain
08/12/2025 | I-Connect007 Editorial TeamJeh Aerospace, the high-precision aerospace and defense manufacturing startup founded by Vishal Sanghavi and Venkatesh Mudragalla, has raised $11 million in a Series A round led by Elevation Capital, with support from General Catalyst, to scale its commercial aircraft supply chain manufacturing in India, according to OEM.
LQDX Inc. Completes Sale of Aluminum Clad Laminate IP to Toyo Aluminium K.K.
07/31/2025 | PR NewswireLQDX, formerly known as Averatek Corp., developer of high-performance materials for advanced semiconductor manufacturing, today announced that it has completed the divestiture of its Aluminum Clad Laminate IP – known as ACL™ – to Toyo Aluminium K.K., a Japan-based global market leader in specialty aluminum-based products for the consumer, electronics and automotive sectors.
Clear Demand Signal Needed for CHIPS Success
08/01/2025 | I-Connect007 Editorial TeamIn July, the National Defense Industrial Association’s (NDIA) Electronics Division released a white paper titled "Clear Demand Signal Needed for CHIPS Success." The paper highlights the importance of the CHIPS and Science Act’s $52 billion investment in revitalizing secure domestic semiconductor production, but also raises the alarm that the Act mainly addresses supply challenges and has not established mechanisms to ensure ongoing demand for U.S.-based microelectronics production.