The Knowledge Base: My 2025 Industry Wish List
Global Sourcing Spotlight: The Surprising World of Offshore B2B Industrial Values
Nolan’s Notes: Emerging Trends in 2025
SMT007 Magazine Explores Soldering Technologies—December 2024
December 2, 2024 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
In the December 2024 issue of SMT007 Magazine, we explore some of the emerging soldering technologies: photonic, vacuum reflow and condensation soldering. And our columnists deep-dive into advanced packaging and international trade.
Learn more in this month’s issue of SMT007 Magazine.
Share on:
Suggested Items
ELMOTEC to Showcase SolderSmart® TOP Automated Soldering Equipment at APEX 2025
01/15/2025 | ELMOTECE-tronix, a Stromberg Company, is excited to announce that they will partner with ELMOTEC to showcase the SolderSmart® TOP Automated Soldering Equipment at APEX 2025 Booth #1703.
SolderKing to Highlight Innovations in Soldering and Manufacturing Efficiency at Southern Manufacturing & Electronics 2025
01/08/2025 | SolderKing Assembly Materials Ltd,SolderKing, a leading UK manufacturer of advanced soldering materials and consumables, will be exhibiting at the Southern Manufacturing and Electronics Show from 4-6 February 2025 at the Farnborough International Exhibition Centre, Stand J90.
IPC Announces UK Regional Qualification for Hand Soldering Competition
01/02/2025 | IPCIPC invites skilled soldering experts to participate in the UK Regional Qualification for the IPC Hand Soldering Competition (HSC) on February 4-6, 2025, at the Farnborough International Exhibition Centre.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in