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Koh Young Honored by Foxconn with 2024 Digital Ecosystem Partner Award

11/26/2024 | Koh Young
Koh Young Technology, the global leader in True 3D measurement-based inspection solutions, is proud to announce that Foxconn honored us on November 15, 2024, with its prestigious 2024 Digital Ecosystem Partner Award.

IPC Japan Puts More Focus on Collaboration, Standards Development, Advanced Packaging

11/26/2024 | Yusaku Kono, IPC Japan Representative
In the past year, IPC has strengthened its relationships with key Japanese companies and government bodies. This was accomplished, in part, by a visit to Japan this past summer, where members of the IPC Asia team, punctuated by standards committee work last winter, forged stronger ties with government officials and companies involved in electronics manufacturing.

Global Notebook Shipments Expected to Grow by 4.9% in 2025, Business Demand Emerges as a Key Driver

11/25/2024 | TrendForce
TrendForce reports that the global notebook market in 2024 is projected to recover at a moderate pace, hindered by high interest rates and geopolitical uncertainties.

SIA Praises Finalization of CHIPS Investments for GlobalFoundries Manufacturing Projects

11/21/2024 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding finalization of semiconductor manufacturing investments announced by the U.S. Department of Commerce and GlobalFoundries.

Romania Becomes the 20th Member of the F-35 Global Alliance

11/21/2024 | Lockheed Martin
The Government of Romania confirmed today its intent to procure 32 Lockheed Martin 5th Generation F-35 Lightning II aircraft by signing a Letter of Offer and Acceptance (LOA) through a U.S. government Foreign Military Sale.
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