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Ennostar Consolidates Resources to Drive High-Value Optical Semiconductors Applications in 3+1 Key Areas

02/25/2025 | TrendForce
In an effort to optimize its organizational structure and accelerate its optical semiconductors business, Ennostar announced on February 21st, 2025, the merger of its subsidiaries—Epistar and Lextar Electronics—under the unified brand of Ennostar Corporation.

KYZEN to Showcase MICRONOX MX2123 Power Module Cleaner at IMAPS Device Packaging Conference 2025

02/21/2025 | KYZEN'
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the International Symposium on Microelectronics (IMAPS) International Conference and Exhibition on Device Packaging scheduled to take place March 3-6 at the Sheraton Grand at Wild Horse Pass in Phoenix, AZ.

Siemens Delivers Certified and Automated Design Flows for TSMC 3DFabric Technologies

02/17/2025 | Siemens
Siemens Digital Industries Software announced, as part of its ongoing collaboration with TSMC, the readiness of an automated and certified workflow for TSMC’s InFO packaging technology using Siemens industry-leading advanced packaging integration solutions.

LQDX, Arizona State University Sign Semiconductor Packaging Collaboration Agreement

02/11/2025 | LQDX
LQDX Inc., developer of high-performance materials and process IP for advanced semiconductor packaging, today announced that it has signed a formal agreement with Arizona State University (ASU) to further its partnership which began in 2024, focused on advanced IC-substrates, Fan Out Wafer Level Packaging (FOWLP) and glass core metallization, as enabled by its Liquid Metal Ink (LMI®) technology.

3M Joins Consortium to Accelerate Semiconductor Technology in the U.S.

02/04/2025 | PR Newswire
3M is expanding its commitment to the semiconductor industry by joining the US-JOINT Consortium, a strategic partnership of 12 leading semiconductor suppliers. The consortium drives research and development in next-generation semiconductor advanced packaging and back-end processing technologies anchored by a new cutting-edge facility in Silicon Valley.
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