SIA Commends Selections for CHIPS R&D Flagship Facilities
November 4, 2024 | SIAEstimated reading time: 1 minute
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the selections for the first two CHIPS for America National Semiconductor Technology Center (NSTC) facilities. The first facility will focus on extreme ultraviolet (EUV) lithography research and will be located within NY CREATES’s Albany NanoTech Complex in New York. The second facility (Sunnyvale, CA) will serve as an administrative headquarters for the NSTC and host the Design Enablement Gateway. Together, these programs will advance semiconductor design, research, workforce development, investment, and collaboration for the U.S. semiconductor industry.
“This week’s announcements mark exciting milestones in the implementation of the critical R&D programs enacted in the bipartisan CHIPS and Science Act. EUV lithography research is an investment in American leadership at the leading edge. And, the Albany facility will democratize access to this extraordinary tool and enable NSTC research to commence in the next year, driving the mission to propel American chip innovation from day one.
“Natcast’s site in Sunnyvale, CA will establish a new hub at the heart of Silicon Valley for the next generation of R&D in chip design, electronic design automation (EDA), chip and system architecture, and hardware security. Moreover, the facility will advance core NSTC programs, including the Workforce Center of Excellence—building our industry’s most essential asset: an innovative and skilled workforce. We congratulate the Department of Commerce and Natcast for initiating these impactful programs and applaud their diligent efforts to continue driving American leadership in chips.”
These resources will be available to NSTC members and researchers. Natcast has opened NSTC membership and urges semiconductor companies, universities, nonprofits and research institutions, national labs, and government agencies to take part in shaping the future of U.S. semiconductor R&D leadership.
Suggested Items
Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association
11/22/2024 | SIAThe Semiconductor Industry Association (SIA) today announced Western Digital CEO David Goeckeler has been elected Chair of the SIA Board of Directors. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from USD 3.9 billion in 2024 to USD 9.2 billion by 2031.
SIA Applauds CHIPS Award for Semiconductor Research Corporation’s SMART USA Institute
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Commerce Department to provide SRC $285 million to establish and operate the CHIPS Manufacturing USA Institute for Digital Twins.
SIA Praises Finalization of CHIPS Investments for GlobalFoundries Manufacturing Projects
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding finalization of semiconductor manufacturing investments announced by the U.S. Department of Commerce and GlobalFoundries.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.