Flexible Thinking: Another PCB Design Paradigm Shift in the Works
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBs
PCB007 Magazine October 2024: Alternate Metallization Processes
October 16, 2024 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop. In the October 2024 issue of PCB007 Magazine, we examine alternate metallization methods, including MacDermid Alpha’s graphite technology and Uyemura’s RAIG technology.
In addition, John Johnson of American Standard Circuits discusses liquid metal ink as a process technology alternative. Dyconex talks about alternative metal elements from the standpoint of R&D and explains sputtering technology. And we revisit Mike Carano’s comprehensive overview of direct metallization technology from our July 2024 issue of PCB007 Magazine.
For all of that and more, get onboard for destination metallization.
Share on:
Suggested Items
U.S. Department of Commerce Announces $1.4 Billion in Final Awards to Support the Next Generation of U.S. Semiconductor Advanced Packaging
01/17/2025 | U.S. Department of CommerceThe U.S. Department of Commerce has announced that CHIPS National Advanced Packaging Manufacturing Program (NAPMP) has finalized $1.4 billion in award funding to bolster U.S. leadership in advanced packaging and enable new technologies to be validated and transitioned at scale to U.S. manufacturing.
onsemi Completes Acquisition of Qorvo’s Silicon Carbide JFET Technology Portfolio
01/16/2025 | onsemionsemi announced that it has completed its acquisition of the Silicon Carbide Junction Field-Effect Transistor (SiC JFET) technology business, including the United Silicon Carbide subsidiary, from Qorvo for $115 million in cash.
Lockheed Martin Delivers the First Aegis System Equipped Vessel AN/SPY-7(V)1 Radar Antenna to Japan Ministry of Defense
01/16/2025 | Lockheed MartinLockheed Martin successfully delivered the first AN/SPY-7(V)1 radar antenna for the Aegis System Equipped Vessel (ASEV) to the Japan Ministry of Defense.
SIA Releases Policy Recommendations for Trump-Vance Administration and 119th Congress
01/16/2025 | SIAThe Semiconductor Industry Association (SIA) released a policy agenda setting forth the U.S. semiconductor industry’s policy priorities and suggested areas for collaboration with the Trump-Vance administration and the 119th Congress.
ELMOTEC to Showcase SolderSmart® TOP Automated Soldering Equipment at APEX 2025
01/15/2025 | ELMOTECE-tronix, a Stromberg Company, is excited to announce that they will partner with ELMOTEC to showcase the SolderSmart® TOP Automated Soldering Equipment at APEX 2025 Booth #1703.