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Compal, ZutaCore Collaborate to Showcase Groundbreaking Waterless Two-Phase Liquid Cooling Server Solutions at SC24

11/25/2024 | Compal Electronics Inc.
Compal Electronics, a global leader in server innovation, has partnered with ZutaCore®, a leading provider of waterless direct-to-chip two-phase liquid cooling (2P DLC) solutions, to introduce a series of groundbreaking server solutions.

IPC Recommends Greater Focus on Electronics Needed for US-based AI Data Centers

10/07/2024 | IPC
A new white paper from IPC, “AI-based Data Centers for the United States: Technologies, Supply Chains, and Resiliency Gaps,” explores the actions needed to improve the supply chain resiliency of U.S.-based artificial intelligence (AI) data centers and the electronics used in them.

NVIDIA Blackwell Platform and ASIC Chip Upgrades to Boost Liquid Cooling Penetration to Over 20% in 2025,

09/23/2024 | TrendForce
TrendForce’s latest reports reveal that the launch of NVIDIA’s Blackwell platform, expected in 4Q24, is set to significantly drive the adoption of liquid cooling solutions. Liquid cooling penetration is projected to grow from around 10% in 2024 to over 20% in 2025.

AI Demand Drives Enterprise SSD Contract Prices Up by 25% in Q2 and Boosts Supplier Revenues by Over 50%

09/13/2024 | TrendForce
TrendForce's latest reports reveal that the second quarter of 2024 saw a significant increase in demand for enterprise SSDs due to the increased deployment of NVIDIA GPU platforms and rising storage needs driven by AI applications, along with a surge in demand from server brands.

Takaya Exhibiting Flying Probe Test Technology at SMTAI 2024

08/29/2024 | Takaya
TEXMAC, the exclusive authorized distributor of Takaya flying probe test systems in North and South America, will be exhibiting highlights of its advanced technology at SMTA International, October 20 - 24, 2024, at the Donald E. Stephens Convention Center in Rosemont, Illinois USA. 
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