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Geopolitical Tensions Fuel a Wave of AI Chip Independence as US and Chinese CSPs Race to Develop In-House ASICs

05/15/2025 | TrendForce
TrendForce’s latest research reveals that the surge in demand for AI servers is accelerating the pace at which major US CSPs are developing in-house ASICs, with new iterations being released every one to two years. In China, the AI server market is adjusting to new US export controls introduced in April 2025, which are expected to reduce the share of imported chips (e.g., from NVIDIA and AMD) from 63% in 2024 to around 42% in 2025.

Dixon, Inventec Form JV for PC Manufacturing in India

05/05/2025 | Dixon
Dixon has entered into Joint Venture Agreement (JV Agreement) with Inventec. Pursuant to the said JV Agreement, Dixon IT Devices Private Limited (JV Company) will be 60% owned by Dixon and 40% owned by Inventec.

Congatec Showcases High-performance Embedded Building Blocks at ElectroneX 2025

04/29/2025 | congatec
congatec, a leading vendor of embedded and edge computing technology, will present its latest high-performance hardware and software building blocks at ElectroneX 2025, taking place at the Melbourne Convention and Exhibition Centre from May 7-8.

U.S. Tariffs to Curb Investment and Consumption Momentum; 2025 Global End-Market Outlook Downgraded

04/08/2025 | TrendForce
On April 2nd, the U.S. announced a new round of reciprocal tariffs, followed by a provision allowing exemption for goods with more than 20% “U.S. value”

Downstream Inventory Reduction Eases DRAM Price Decline in 2Q25

03/25/2025 | TrendForce
TrendForce’s latest findings reveal that U.S. tariff hikes prompted most downstream brands to frontload shipments to 1Q25, accelerating inventory reduction across the memory supply chain.
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