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Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology

06/17/2025 | Nordson Electronics Solutions
Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case,

Siemens Collaborates with Samsung Foundry on Advanced Node Product Certifications and EDA Innovation

06/17/2025 | Siemens
Siemens Digital Industries Software announced a significant expansion of its collaboration with Samsung Foundry, including extending certification for many of Samsung’s most advanced process technologies across Siemens’ comprehensive Electronic Design Automation (EDA) portfolio.

Phoenix to Host SEMICON West 2025 for the First Time, Showcasing Arizona’s Critical Role as a Semiconductor Manufacturing Hub

06/16/2025 | SEMI
SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, today announced strategic partnerships for this year’s SEMICON® West with Alliance Sponsors Arizona Commerce Authority (ACA), Greater Phoenix Economic Council (GPEC), and Visit Phoenix.

Imec, Tokyo Electron Extend Partnership to Accelerate the Development of Beyond-2nm Nodes

06/16/2025 | Imec
Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, has extended its strategic partnership with Tokyo Electron (TEL), a leading Japanese supplier of semiconductor production equipment.

SEMI Announces Election of Tien Wu, ASE CEO, as International Board Chair

06/12/2025 | SEMI
SEMI, the industry association representing the global electronics design and manufacturing supply chain, today announced that its International Board of Directors has elected Dr. Tien Wu, CEO of Advanced Semiconductor Engineering, Inc. (ASE), as its new chair, and Benjamin Loh, Chair of Comet AG, as its new vice chair, effective immediately, in accordance with the association's by-laws.
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