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Indium to Showcase Innovative Materials Powering AI Technology at Productronica China

03/25/2025 | Indium Corporation
As a proven leader in Metal-Based Thermal Interface materials solutions for future-forward technologies, Indium Corporation will proudly showcase its portfolio of thermal interface materials (TIMs) that enabling AI advancements at Productronica China, March 26-28, in Shanghai, China.

DuPont Interconnect Materials Enabling Advancements in Aerospace & Defense, Next-Gen Automotive, and AI

03/19/2025 | DuPont
DuPont Interconnect Solutions (ICS)—a leading material solutions and systems design partner within DuPont Electronics & Industrial that addresses signal integrity and power and thermal management challenges—will showcase the benefits of its materials for printed circuit board (PCB) manufacturing and electronics assembly at IPC APEX Expo.

Ventec Presents Cutting Edge Innovations and High-performance Formulas at IPC APEX EXPO 2025

03/14/2025 | Ventec International Group
Ventec International Group is presenting new substrate materials and proven formulas for high-performance PCBs at IPC APEX Expo 2025, alongside the latest advances in manufacturing equipment from Ventec Giga Solutions.

Aismalibar to Showcase Advanced Thermal Management Solutions at APEC 2025

03/13/2025 | Aismalibar
Aismalibar, a global leader in high-performance thermal management materials, is set to exhibit at APEC 2025 (Applied Power Electronics Conference) in Atlanta, Georgia, from March 16–20, 2025. As the premier event for power electronics professionals, APEC provides a crucial platform for industry leaders to explore the latest advancements in thermal interface materials (TIMs), high-performance PCB laminates, and insulated metal substrates (IMS).

Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI

03/12/2025 | Ventec International Group
Ventec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
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