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Suggested Items

Rehm Thermal Systems Brings Pioneering Manufacturing Technologies to productronica China 2025

02/11/2025 | Rehm Thermal Systems
Rehm Thermal Systems will be presenting its further developments in areas such as convection soldering under vacuum, condensation soldering, coating and dispensing in Hall E4 of the Shanghai New International Expo Centre from 26 to 28 March.

Advancements in Thermal Management: Material Talk With DuPont

02/06/2025 | Marcy LaRont, I-Connect007
As our DesignCon coverage continues, this insightful discussion featuring Mike Kwasny, business development manager at DuPont, delves into technologies and innovations in electronics manufacturing featuring their unique material solutions, including their Kapton film and Pyralux laminate lines. 

Indium Expert to Address Thermal Challenges at TestConX 2025

02/04/2025 | Indium Corporation
Indium Corporation Technical Support Engineer Carson Burt will deliver a technical presentation at TestConX 2025, taking place March 3-5 in Mesa, Arizona.

YINCAE Launches UF 120LA

02/04/2025 | YINCAE
YINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With exceptional flowability into 20μ gaps, UF 120LA eliminates cleaning processes, reducing costs and environmental impact while ensuring superior performance across applications like BGA, flip chip, WLCSP, and multi-chip modules.

Advanced Chip and Circuit Materials Shows 224 Gb/s Laminates and Prepregs at DesignCon 2025

01/27/2025 | Advanced Chip and Circuit Materials
Advanced Chip and Circuit Materials, Inc. (ACCM) will be showing its high-performance circuit materials, including its Celeritas Series laminates and prepregs at the DesignCon 2025 exhibition.
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