The Knowledge Base: My 2025 Industry Wish List
Global Sourcing Spotlight: The Surprising World of Offshore B2B Industrial Values
Nolan’s Notes: Emerging Trends in 2025
StratEdge Semiconductor Packages Set to Take the Spotlight at European Microwave Week and IMAPS Symposium
September 11, 2024 | StratEdgeEstimated reading time: 1 minute
StratEdge Corporation, leader in the design and production of high-performance semiconductor packages for microwave, millimeter-wave, and high-power devices, announces that it will be exhibiting in booth 923B at European Microwave Week (EuMW), being held at Porte de Versailles Paris, France from September 24-27, and booth 313 at IMAPS International Symposium for Microelectronics being held at the Encore Boston Harbor in Everett, Massachusetts, on October 1-2.
StratEdge designs and manufactures packages for RF, microwave, and millimeter-wave devices used in a wide variety of applications and industries. These hermetic and quasi-hermetic packages have ultra-low losses over wide frequencies. High-reliability designs feature high thermal conductivity and 50 ohm impedance transition designs. StratEdge packages have been proven on Mars, having powered the communications systems in the four most recent Mars Rovers. With expertise in high-frequency packages, StratEdge has been manufacturing in California since 1985.
StratEdge not only makes packages, but provides complete assembly services. Assembly is performed in StratEdge's ISO 9001:2015 facility, recently re-certified until 2027. Our facility contains a Class 1000 cleanroom and Class 100 work area with workstations for performing sensitive operations. Assembly services include manual and fully automatic wire and die bonding.
"Working with compound semiconductors, such as gallium nitride (GaN) or gallium arsenide (GaAs), requires a package that can best dissipate the heat from the device while ensuring that the device performs at its optimum potential," said Casey Krawiec, VP global sales for StratEdge. "Although the package plays the most critical part, the way the chip is assembled also has a significant impact on how the device performs. Please stop by our booth at EuMW or IMAPS Symposium to discuss your application."
Share on:
Suggested Items
Focus on electronica: Future Challenges From a Designer’s Viewpoint
01/09/2025 | I-Connect007 Editorial TeamThomas Romont is CEO of WorldWide Electronic Circuits in Nantes, France, and chair of the IPC Designers Council France. He gave a presentation at electronica titled Challenges for the Future From a PCB/PCBA Designer Perspective. We asked Thomas to share his thoughts about the class, why this topic is so important, and what he hoped attendees would take away from his class.
The Shaughnessy Report: A Stack of Advanced Packaging Info
12/10/2024 | Andy Shaughnessy -- Column: The Shaughnessy ReportIt’s only fitting that this issue on advanced packaging and stackup features a “stackup” of “packages” on the cover. There’s certainly a lot to “unpack” in this issue. As advanced packaging moves further into the mainstream of PCB design, more PCB designers and design engineers are realizing this isn’t a plug-and-play technology. As we see in this issue, advanced packaging can have an impact on the entire design—the stackup in particular.
ZESTRON South Asia releases whitepaper – Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield
12/02/2024 | ZESTRONZESTRON, the global leading provider of high precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to release the whitepaper “Impact of Cleaning Technology on Discrete Packaging - The Difference in Wire Bonding Yield”
Würth Elektronik Expands Signal LED Product Range
11/21/2024 | Wurth ElectronicsWürth Elektronik expands its proven LED product series WL-SMCW and WL-SMCC with white LEDs in 0603 and 0402 packages.
Unlock Unmatched Performance for Matched Impedance Devices with StratEdge at IEEE BCICTS 2024
10/22/2024 | StratEdgeStratEdge Corporation, an industry leader in high-frequency and high-power semiconductor packaging, is excited to announce its participation in the IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS).