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Advanced Electronics Packaging Digest

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GE Aerospace Investing $225M to Modernize Research Center

09/24/2026 | GE Aerospace
GE Aerospace announced a $225 million investment to modernize the GE Aerospace Research Center in Niskayuna, NY, advancing the site's legacy as the innovation engine behind breakthroughs in aviation advancements.

Qualcomm to Acquire PickNik to Advance the Future of Open Robotics and Physical AI

09/24/2026 | Qualcomm Technologies, Inc.
Qualcomm Technologies, Inc. announced its agreement to acquire PickNik Inc., an industry recognized robotics software company and longtime steward of MoveIt, one of the world's most widely adopted open-source robotics manipulation frameworks.

Siemens, TSMC Advance AI-powered Semiconductor Design Automation

09/24/2026 | Siemens
Siemens announced continued collaboration with TSMC to drive innovation in AI-powered automation and advanced semiconductor design enablement.

Technica USA Participates at NEDME

09/24/2026 | Technica USA
Technica USA, along with key supply partners DCT and Inovaxe, participated this week in the Northwest Electronics Design & Manufacturing Expo (NEDME) in Hillsboro, Oregon.

Catching Up With PCB Technologies’ Issey Ende

09/24/2026 | Dan Beaulieu, D.B. Management Group
There are certain conversations you walk away from knowing you’ve just spoken with someone who truly understands where the electronics industry is headed. That was exactly my experience talking with PCB Technologies executive Issey Ende. I was impressed by Issey’s deep understanding of what customers need. He speaks with the perspective of someone who has spent decades inside the industry, watching the transformation of PCB manufacturing into a highly complex global technology infrastructure.
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