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NEC Improves the Energy Efficiency and Floor Space Density of 5G Mobile Core Systems

03/18/2025 | ACN Newswire
NEC Corporation has improved the performance-to-power ratio of 5G mobile core systems (5GC) by more than 6 times, as well as floor space density by 10 times. This was accomplished using Intel Xeon 6 processors with E-Cores under a traffic load and model based on actual commercial traffic patterns.

Incap Slovakia Upgrades PCBA Cleaning Technology

03/18/2025 | Incap
At Incap Slovakia, maintaining high product quality requires continuous improvement in PCBA cleaning processes. Our new PCBA washing system is now fully operational, bringing enhanced cleaning performance, increased automation, and improved sustainability to our production.

Phil Zarrow Scheduled to Host SMT Bootcamp at BEST Inc. on May 19-20

03/17/2025 | BEST Inc.
BEST Inc., a leader in electronic component services, training, and products is pleased to announce it will host a two-day SMT Bootcamp course taught by industry veteran Phil Zarrow. 

Universal Instruments and Parent Company Delta Feature Automation Solutions for the Next Era at APEX

03/17/2025 | Universal Instruments
Universal Instruments and parent company Delta, a global leader in power and thermal management technologies and a world-class provider of industrial automation solutions, will exhibit on booth 1305 at the 2025 IPC APEX EXPO in Anaheim, CA on March 18–20.

Hentec Industries/RPS Automation to Showcase Valence 2508 at IPC Expo 2025

03/17/2025 | Hentec Industries/RPS Automation
The Valence 2508 Selective Soldering System is engineered for high-mix, high-volume, advanced PCB production. It supports boards ranging from 25 x 25 mm to 559 x 559 mm (1 x 1 in. to 22 x 22 in.), with a maximum processing area of 508 x 508 mm (20 x 20 in.).
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