Standard of Excellence: Building Trust with Customers—The Foundation of Excellent Service
Global Citizenship: Global Citizenship in Environmental Sustainability
SMT Perspectives and Prospects: Artificial Intelligence, Part 4—Prompt Engineering
Nordson Electronics Solutions to Exhibit at SEMICON Taiwan 2024
August 28, 2024 | Nordson Electronics SolutionsEstimated reading time: Less than a minute
Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, will feature the latest technologies in fluid dispensing for semiconductor advanced packaging at the SEMICON Taiwan tradeshow, booth L0516.
On display will be the ASYMTEK Forte® fluid dispensing system, configured for high productivity and accuracy for many semiconductor packaging and microelectronics manufacturing applications. The Forte system is ideal to tackle high-volume underfill, dispense gap fill, and sealing lines for fan-out/fan-in, strips, and module assembly.
Other featured technologies include developments for high-throughput panel-level packaging (PLP) and wafer-level packaging (WLP), and handling the challenges of warpage during fluid dispensing operations. Presentations will be available to show different configurations for WLP and PLP on the ASYMTEK Vantage® fluid dispensing system, and how these systems can successfully ensure precise dispense results with high throughput.
Experts will be ready to discuss how Nordson can support your manufacturing of reliable semiconductor products. SEMICON Taiwan will be held at TaiNEX, Taipei Taiwan, September 4-6, 2024.
Especially for wafer-level and panel-level packaging, these technologies ensure high-throughput, precise dispense results within the same footprint as current equipment.
Share on:
Suggested Items
Koh Young Partners with NTV USA to Expand its Advanced Packaging and Semiconductor Inspection Solutions in the United States
01/28/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, is excited to announce its partnership with NTV USA (NexTex Ventures, LLC) to bring its proven inspection technologies to the semiconductor industry.
TRUMPF, SCHMID Group Enable Cost-effective High-speed Chips
01/24/2025 | SCHMID GroupTRUMPF and the SCHMID Group are developing an innovative manufacturing process for the latest microchip generation for the global chip industry.
GlobalFoundries Announces New York Advanced Packaging and Photonics Center
01/24/2025 | GlobalFoundriesGlobalFoundries (GF) announced plans to create a new center for advanced packaging and testing of U.S.-made essential chips within its New York manufacturing facility.
iNEMI Packaging Tech Topic Webinar: Overcoming Challenges in 3D Packaging Test & Inspection
01/23/2025 | iNEMIRegister today for a free webinar on February 13th to explore emerging solutions for testing and inspecting complex 3D semiconductor packaging.
KYZEN to Feature MICRONOX MX2123 Power Module Cleaner at iMAPS Wire Bonding Workshop
01/22/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the International Symposium on Microelectronics (iMAPS) Wire Bonding 2025 Workshop and Tabletop Exhibition, scheduled to take place February 3-4 at the Westin San Diego Bayview.