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Zuken Joins IBM Research AI Hardware Center to Develop Next-Generation AI Hardware Solutions
March 24, 2025 | ZukenEstimated reading time: 1 minute
Zuken Inc. announced an agreement with IBM to join the IBM Research AI Hardware Center as a commercial member. The IBM Research AI Hardware Center, a global research hub headquartered at the Albany NanoTech Complex in Albany, NY, aims to develop next-generation chips and systems, including advanced semiconductor packaging, that support the processing power and unprecedented speed that AI requires.
Zuken has also signed an agreement with IBM for the joint research and development of heterogeneous chip integration packaging solutions, which is critical for AI accelerator architecture. The collaboration will focus on 3-D integrated circuit (3DIC) packaging design for advanced semiconductors and optimizing Electronic Design Automation (EDA) workflows. Zuken will support the evaluation of a prototype deep learning accelerator core from IBM’s digital and analog projects. Additionally, Zuken will contribute to material development and processes modeling, and integration assembly methods for interconnecting multiple IC dies within a semiconductor packaging module. The agreement will further focus on reliability testing, performance simulation, and hardware validation.
"Zuken is pleased to collaborate with IBM Research as a member of the AI Hardware Center and joint development partner," said Kazuhiro Kariya, Zuken's Senior Managing Executive Officer and CTO. "Our unique system-level design platform supports innovation in 3DIC heterogeneous integration design process by enabling a practical SOC/package/PCB co-design environment. Zuken aims to play an important role in the next-generation high-end device development ecosystem."
“We are thrilled to be working with Zuken to accelerate chip packaging and AI hardware innovation,” said Jeff Burns, Director of the IBM Research AI Hardware Center. “These advances will play a critical role in unlocking the performance and efficiency needed for the future of AI.”
Zuken views 3DIC packaging design as a key enabler for future technological innovation and continues to invest in R&D. Open collaboration with industry consortiums is critical, and our collaboration with IBM Research reflects our commitment to expanding technological capabilities and providing innovative solutions to our customers.
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