Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
TopLine Introduces Braided Columns as Drop-in Replacement for BGA Solder Balls
June 17, 2024 | TopLineEstimated reading time: 1 minute
TopLine Corporation announces the introduction of braided solder columns as a drop-in replacement for solder spheres used in Ball Grid Array (BGA) components. “Traditional Ball Grid Array (BGA) spheres have a history of failing in large sized BGA packages due to thermal stress and CTE mismatch,” TopLine CEO Martin Hart states.
Recognizing this weakness, TopLine has developed a family of Braided Solder Columns especially suited for cryogenic environments and next generation applications, replacing solder balls on IC packages of varying sizes. These columns provide improved reliability and thermal properties over competing technologies. Solder balls and heritage copper wrapped solder columns are not equal to the task. Hart already holds multiple patents in the field of column grid arrays.
This new generation of non-collapsible, RoHS compliant Lead-Free Copper Braided Solder Columns are designed to absorb destructive strain caused by differences in the Coefficient of Thermal Expansion (CTE) of materials between large sized heterogeneous 2.5D packages and FR4 printed circuit boards (PCB). This novel solder column technology is intended to replace solder balls typically found on ball grid array (BGA) packages as literally a drop-in replacement.
These next generation non-collapsible lead-free copper braided solder columns absorb destructive strain (stress) caused by differences in CTE between the chip package and the PCB. Its cylindrical shape and mechanical compliancy enable solder columns to support large packages, analogous to the way palm trees flex on a windy day without breaking. “With the industry trending to design larger and larger heterogeneous 2.5D BGA packages to meet the massive processing needs of AI and data centers,” Hart says, “BGA packages have an increasing potential for solder balls to crack and delaminate, resulting in catastrophic failure of the system. These new columns can prevent that stress-induced damage.”
Share on:
Suggested Items
SolderKing’s Successful Approach to Modern Soldering Needs
06/18/2025 | Nolan Johnson, I-Connect007Chris Ward, co-founder of the family-owned SolderKing, discusses his company's rapid growth and recent recognition with the King’s Award for Enterprise. Chris shares how SolderKing has achieved these award-winning levels of service in such a short timeframe. Their secret? Being flexible in a changing market, technical prowess, and strong customer support.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
06/09/2025 | Dr. Eyal Weiss, CybordAs the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.