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KYZEN to Showcase Advanced Packaging Solutions at PCIM Europe 2024
May 14, 2024 | KYZEN'Estimated reading time: Less than a minute
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is excited to announce its participation in PCIM Europe 2024, scheduled to take place June 11-13, 2024 in Nuremberg, Germany. Visitors can find KYZEN at Hall 5, Stand 100, where the focus will be on advanced packaging solutions, specifically highlighting the MICRONOX® MX2123 Multi-Process Power Module Cleaner.
MICRONOX MX2123 is a cutting-edge, aqueous, multi-phase chemistry meticulously crafted to eliminate flux residues from various IGBT module devices employing a combination of copper, silver and nickel DBC substrates, alongside PCBs. With its precisely balanced formula, MX2123 ensures exceptional surface conditions for subsequent wire bonding and potting processes, while safeguarding base metals with its retention of anti-oxidation materials like Organic Solderability Preservative (OSP) post-cleaning.
Renowned for its effectiveness at low temperature and concentration levels, MX2123 can be effortlessly monitored in both in-line SIA cleaning systems and Ultrasonic Immersion cleaning systems.
PCIM Europe is a premier event for power electronics and its applications, offering a platform for industry leaders to showcase the latest innovations and technologies. For more information about KYZEN and its advanced packaging solutions, stop by Hall 5, Stand 100.
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