Flexible Thinking: Rules of Thumb—A Word to the Wise
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBs
LPKF is Ready for Increasing Demand for Glass Substrates in the Semiconductor Industry
May 13, 2024 | LPKFEstimated reading time: 2 minutes
The semiconductor industry is shifting towards glass to package the most advanced semiconductor chips. LPKF’s mature LIDE technology is enabling that transition into this new era from ramp-up to high volume manufacturing.
Major changes in the semiconductor market
New developments in data center, and automotive markets require new semiconductor solutions. This market demand is driven by trends like high performance computing, remote working, Artificial Intelligence, and self-driving cars.
Major challenges for the semiconductor industry are the competitive price levels to produce semiconductor solutions, differentiation in the supply chains and new requirement due to changing markets. The semiconductor market is therefore evolving constantly.
Major global players introduced glass as promising new solution to address industrial needs in high performance computing and AI applications. They recently announced that glass substrates will become the new market standard.
Advanced packaging with glass substrates
Moore’s law is slowing down. The semiconductor industries solutions to compensate this slowdown are advanced packaging and heterogenous integration. This is reached by using different chips manufactured with different advanced manufacturing processes.
One future building block for advanced packaging and heterogeneous integrations is glass as the substrate material. It serves as a solution to overcome packaging challenges with materials like silicon and glass fiber reinforced plastics.
Since many years, LPKF has invested into research, processes, and product development and reached an outstanding level of maturity to provide production capabilities for high-volume manufacturing. “Our technology reached an outstanding level of maturity to meet the semiconductor industry’s needs. For that reason, we increased our production capacities in 2024 to satisfy the increasing customer demand.” states Klaus Fiedler, CEO of LPKF.
In the past 10 years, LPKF has developed its industrial processes for glass manufacturing using highest quality standards and with focus on throughput to reach industrial requirements. The LIDE process (Laser Induced Deep Etching) developed by LPKF is well established. Glass substrates from 100µm up to 1.1mm can be processed quickly, precisely, and without damage such as microcracks. This is essential for the scalability, reliability, and cost efficiency of the electronic package.
High process maturity of LPKF technology
High process maturity and tangible operational proof of performance convinced global players to collaborate with LPKF. LPKF supports customers throughout the adoption of glass core for advanced packaging application by integrating the technology into customers manufacturing processes or providing manufacturing service by its Vitrion division. With dozens of worldwide installed tools and thousands of manufactured glass substrates in LPKF’s own manufacturing facility, LPKF gave proof of the maturity of the technology.
“Global players value the high precision, flexibility and design freedom of LIDE technology.” underlines Dr. Roman Ostholt, Managing Director Electronics. LPKF’s long-lasting experience and presence on the market is an additional plus. This is the reason for being a reliable partner and the increasing demand in LPKF’s technological solutions from the semiconductor industry.
Outstanding know-how and quality, the capacity to satisfy the market demand and to support industry partners in making the step into using glass substrates in the semiconductor industry makes LPKF to a reliable global partner.
Share on:
Suggested Items
Hon Hai Research Institute, Yangming Jiaotong University Jointly Won the Future Technology Award
11/26/2024 | Hon Hai Technology GroupHon Hai Research Institute (HHRI), a subsidiary of Hon Hai Technology Group, the world’s largest technology manufacturing and service provider, joins hands with National Yang -Ming Chiao Tung University ( NYCU ) to break through space Computing Extreme stood out at the " 2024 Taiwan Innovation Technology Expo" and won the "Future Technology Award" for its innovative technology of "application of all-gallium arsenide super interface holography in structured light and stereoscopic vision".
Biden-Harris Administration Announces CHIPS Incentives Awards with BAE Systems, Rocket Lab
11/25/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce has finalized two separate awards under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities. The Department awarded BAE Systems Electronic Systems, a business unit of BAE Systems, Inc., up to $35.5 million in direct funding, and awarded Rocket Lab, the parent company of space power provider SolAero Technologies Corp., up to $23.9 million in direct funding. The Department will disburse the funds based on the companies’ completion of project milestones.
Indium Technical Expert to Present at SiP Conference China
11/25/2024 | Indium CorporationIndium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China Conference 2024 on November 27 in Suzhou, China.
American Made Advocacy: The Administration Changed, but Our Industry’s Needs Remain
11/26/2024 | Shane Whiteside -- Column: American Made AdvocacyThe beginning of the holiday season in Washington, D.C., this year also signals the changes that come with a new administration. Here are my projections about the effect on our industry. There will be a lot of noise in Washington when a new president occupies the White House and new members of Congress arrive on the scene. It is every member’s job to remind them all that “chips don’t float” and that there is more work to be done to create a secure and resilient supply chain for the microelectronics we depend on.
Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association
11/22/2024 | SIAThe Semiconductor Industry Association (SIA) today announced Western Digital CEO David Goeckeler has been elected Chair of the SIA Board of Directors. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.