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India’s PC Market Shipped an All-Time High of 4.49 Million Units in 3Q24

11/26/2024 | IDC
India’s traditional PC market (inclusive of desktops, notebooks, and workstations) shipped an all-time high of 4.49 Million Units in 3Q24, up 0.1% year-over-year (YoY) according to new data from the International Data Corporation (IDC) Worldwide Quarterly Personal Computing Device Tracker.

McCauley Design Group Spreads the CAMM2 Gospel

07/30/2024 | Andy Shaughnessy, Design007 Magazine
At PCB East, I met Charlene McCauley and Terrie Duffy of the McCauley Design Group. The duo was leading a class on designing with the new CAMM2 DDR5, a JEDEC specification and standard created by Dell, which is due to replace the aging SO-DIMM in laptops. The CAMM2 (Compression Attach Memory Module) is solderless and frees up lots of real estate that SO-DIMM famously requires.

Cambridge, Intel and Dell Join Forces on UK’s Fastest AI Supercomputer

11/27/2023 | Cambridge University
The Cambridge Open Zettascale Lab is hosting Dawn, the UK’s fastest artificial intelligence (AI) supercomputer, which has been built by the University of Cambridge Research Computing Services, Intel and Dell Technologies.

Dell Technologies, Denvr Dataworks to Unleash Generative AI Innovation

08/30/2023 | PRNewswire
Dell Technologies and Denvr Dataworks, an emerging provider of high-performance cloud infrastructure, are working together to help organizations tap the capabilities of generative AI (GenAI).

The Pulse: Rough Roughness Reasoning

07/20/2023 | Martyn Gaudion -- Column: The Pulse
Reliable bonding reduces the risk of delamination through thermal stresses. The tried-and-tested way of achieving a good, reliable bond is to ensure that the copper is sufficiently rough to promote adhesion to the epoxy resin in the prepreg material. As materials and bonding technology improves, the copper surfaces can be made increasingly flatter and still achieve the desired reliability. In the future, new bonding methods—some already here but still on the high-priced side of the equation— may allow extremely flat copper to bond reliably. Meanwhile, as the industry is heading down the road of “smoother” copper, there is still a need to model the effects of a rough surface on signal transmission.
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