-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
Soldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
SIA Applauds Launch of Over $5 Billion in CHIPS R&D Investments, Workforce Initiatives
February 12, 2024 | SIAEstimated reading time: 2 minutes
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the administration’s launch of over $5 billion in semiconductor R&D investments through the National Semiconductor Technology Center (NSTC), as well as funding for vital semiconductor workforce initiatives and other programs. The NSTC is a critically important entity established by the CHIPS and Science Act of 2022 to promote U.S. semiconductor R&D. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
“Today’s announcement ushers in the next phase of implementing the landmark semiconductor R&D and workforce initiatives in the CHIPS and Science Act and fulfilling its tremendous promise to reinforce America’s economy, national security, and technological leadership. We applaud leaders in Washington for advancing funding for the NSTC and other vital semiconductor programs. I was honored to attend today’s announcement at the White House, and we look forward to continuing to work with the administration to ensure effective and expeditious implementation of these initiatives, which will strengthen U.S. semiconductor innovation, production, and the domestic chip workforce for many years to come.”
Semiconductor R&D fuels America’s economic growth, national security, and technological competitiveness. The NSTC was established to invigorate semiconductor innovation in the U.S. and drive workforce development opportunities to meet the needs of our rapidly growing industry.
SIA and the Boston Consulting Group (BCG) in October 2022 released a report identifying five key areas of the semiconductor R&D ecosystem that should be strengthened by the CHIPS Act’s R&D funding. The report, titled “American Semiconductor Research: Leadership Through Innovation,” highlights the importance of government-industry collaboration on the NSTC and the National Advanced Packaging Manufacturing Program (NAPMP). The study also calls for CHIPS funding to be used to bridge key gaps in the current semiconductor R&D ecosystem to help pave the way for sustained U.S. chip innovation leadership.
The CHIPS Act’s manufacturing incentives have already sparked substantial investments in the U.S. In fact, companies in the semiconductor ecosystem have announced dozens of new projects across America—totaling more than $220 billion in private investments—since the CHIPS Act was introduced. These announced projects will create more than 40,000 jobs in the semiconductor ecosystem and support hundreds of thousands of additional U.S. jobs throughout this economy.
Suggested Items
Sunny Stalnaker of ASML to Receive SEMI Sales and Marketing Excellence Award
01/30/2025 | ASMLSEMI announced that Sunny Stalnaker of ASML has won the 2025 SEMI Sales and Marketing Excellence Award, inspired by Bob Graham.
SIA Applauds House Introduction of Legislation to Strengthen American Chip Manufacturing and Design
01/29/2025 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the introduction in the U.S. House of Representatives of the bipartisan Semiconductor Technology Advancement and Research (STAR) Act.
Koh Young Partners with NTV USA to Expand its Advanced Packaging and Semiconductor Inspection Solutions in the United States
01/28/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, is excited to announce its partnership with NTV USA (NexTex Ventures, LLC) to bring its proven inspection technologies to the semiconductor industry.
iNEMI Packaging Tech Topic Webinar: Overcoming Challenges in 3D Packaging Test & Inspection
01/23/2025 | iNEMIRegister today for a free webinar on February 13th to explore emerging solutions for testing and inspecting complex 3D semiconductor packaging.
StratEdge Partners with Vitale Engineering as Manufacturer's Representative for Upstate New York
01/22/2025 | StratEdgeStratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages, has appointed Vitale Engineering as its exclusive Manufacturer’s Representative for Upstate New York. Known for their customer-focused approach and technical expertise,