Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Global PCB Connections: Embedded Components—The Future of High-performance PCB Design

06/19/2025 | Jerome Larez -- Column: Global PCB Connections
A promising advancement in this space is the integration of embedded components directly within the PCB substrate. Embedded components—such as resistors, capacitors, and even semiconductors—can be placed within the internal layers of the PCB rather than mounted on the surface. This enables designers to maximize available real estate and improve performance, reliability, and manufacturability.

Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing

06/11/2025 | Nordson Electronics Solutions
Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. edwd

Keysight, Synopsys Deliver an AI-Powered RF Design Migration Flow

06/06/2025 | BUSINESS WIRE
Keysight Technologies, Inc. and Synopsys, Inc. introduced an AI-powered RF design migration flow to expedite migration from TSMC’s N6RF+ process to N4P technology, to address the performance requirements of today’s most demanding wireless integrated circuit applications.

AMD Acquires Brium to Strengthen Open AI Software Ecosystem

06/05/2025 | AMD
At AMD, we’re committed to building a high-performance, open AI software ecosystem that empowers developers and drives innovation. Today, we’re excited to take another step forward with the acquisition of Brium, a team of world-class compiler and AI software experts with deep expertise in machine learning, AI inference, and performance optimization.

Cadence Extends Support for Automotive Solutions on Arm Zena Compute Subsystems

06/05/2025 | Cadence Design Systems, Inc.
Cadence announced IP, design solution, and expert design services for software and Systems-on-Chip (SoCs) based on Arm® Zena™ Compute Subsystems (CSS), Arm’s first-generation CSS for automotive.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in