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Follow the Story: The Business of Engineering

08/19/2026 | I-Connect007
Building great products requires great engineering, but building a successful engineering company requires something more. Leaders must make decisions about investments, acquisitions, workforce development, automation, sourcing, strategy, and innovation, all while navigating changing markets and emerging technologies. This collection of articles and columns explores the business side of technical leadership, by gathering perspectives from executives, engineers, entrepreneurs, and industry experts who understand that long-term success depends on more than technical excellence.

August I-Connect007 Magazine: The Electronics Ecosystem From Design to Development

08/18/2026 | I-Connect007 Editorial Team
This issue of I-Connect007 Magazine examines how collaboration across the electronics ecosystem—from design through fabrication, packaging, AI infrastructure, and flexible circuits—drives innovation and manufacturable products. Our contributors explore co-design from multiple perspectives, using analogies from the forest to the Olympics. We also revisit VeCS for high layer count HDI PCB fabrication, plating challenges for advanced packaging, new applications for flex circuits in robots, and how the U.S. national defense policy could affect PCB sourcing.

3 Key Takeaways: Factory Analytics Turns Data Into Action

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Every electronics manufacturer generates data. The challenge is knowing what to do with it. In The Printed Circuit Assembler's Guide to... Factory Analytics, Julie Cliche-Dubois of Cogiscan explains how manufacturers can transform disconnected machine data into meaningful insights that improve productivity, quality, and profitability. Rather than focusing on analytics as an IT initiative, the book demonstrates how factory-wide visibility empowers everyone, from line operators to quality managers, to make smarter decisions.

Advanced Packaging, Materials Characterization, and System Integration: What’s Ahead in the Advanced Electronics Packaging Digest

08/11/2026 | I-Connect007 Editorial Team
The August issue of Advanced Electronics Packaging Digest explores how advanced packaging is reshaping semiconductor innovation through better materials characterization, heterogeneous integration (HI), workforce education, and system-level design. Together, these features examine the technologies and engineering decisions driving the next generation of electronic systems.

The Marketing Minute: Why I Wrote 'Marketing in 17 Minutes'

08/12/2026 | Brittany Martin -- Column: The Marketing Minute
This month, I'm excited to release my first book, "Marketing in 17 Minutes: A Guide to Marketing in the Electronics Industry." After writing 17 (and more) Marketing Minute columns and working with electronics companies, I realized I was repeatedly answering similar marketing questions. Rather than leaving those lessons scattered across a year's worth of columns, I brought them together into one practical guide. 
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