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Review: PCEA Orange County Summer Meeting

08/06/2025 | Dan Feinberg, Technology Editor, I-Connect007
The Printed Circuit Engineering Association (PCEA) represents a community of engineers, designers, and industry influencers dedicated to the advancement of PCB technology, design, and manufacturing, and the growth and knowledge of its membership. PCEA regularly hosts events to share the latest developments, best practices, and visions for the future of electronic design and manufacturing. The Orange County chapter seems to be one of the largest and most active ones and I was invited to attend the latest chapter event on July 24 in Costa Mesa, California.

Semiconductors Get Magnetic Boost with New Method from UCLA Researchers

07/31/2025 | UCLA Newsroom
A new method for combining magnetic elements with semiconductors — which are vital materials for computers and other electronic devices — was unveiled by a research team led by the California NanoSystems Institute at UCLA. 

Solving the Toughest BGA Challenges in Electronics

07/30/2025 | Nash Bell, BEST Inc.
Since the late 1990s, ball grid array (BGA) packages have emerged as a preferred package style for electronic devices. Compared with high-density ultra-fine pitch quad flat packs (QFPs), BGA packages significantly reduce the required footprint on printed circuit boards (PCBs) by approximately 50%.

Global Dry Film Photoresist Market Set for Robust Growth with Expanding Semiconductor Ecosystem

06/24/2025 | PRNewswire
In 2024, the global market size of Dry Film Photoresist was estimated to be worth US$939 million and is forecast to reach approximately US$1191 million by 2031 with a CAGR of 3.5% during the forecast period 2025-2031.

OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding

06/21/2025 | BUSINESS WIRE
OKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.
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