The Marketing Minute: Cracking the Code of Technical Marketing
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
YAMAHA to Showcase Intelligent Factory Solutions at Productronica
October 20, 2023 | Yamaha Motor Corporation, USAEstimated reading time: 1 minute
Yamaha Motor Corporation’s Robotics Division will highlight an exciting array of new machines and technologies at Productronica 2023, in Hall A3, Booth 323. They will be showcasing the new YAMAHA “YR” Series Platforms with their unique features and added values, coupled with YSUP Intelligent Factory Solutions.
YAMAHA’s 1-Stop Smart Solution helps maximize line productivity and factory efficiency with Yamaha Integrated Solutions and YAMAHA’s Intelligent Factory YsUP Software. YAMAHA’s IoT/M2M Integration system allows linking their SMT machines to equipment made by other companies to provide all-around high productivity and performance monitoring.
YAMAHA’s Best-in-Class solutions are high quality, fully flexible machines that deliver efficiency, quality, and reliability.
In addition Mr. Kamil Stasiak, YAMAHA’s SMT Product Marketing Manager, will present a paper titled, “Production Dashboard with Auto Analytical Functionality” at the Productronica Forum 2023, in Hall A1 on Thursday, November 16, 2023, at 11 a.m.
The main message of YAMAHA’s exhibit booth will be the added value of YAMAHA Intelligent Factory software, focusing on its ease of use, simple networking and communication to other machines and 3rd party software systems.
YAMAHA’s long experience, based on “Kando” philosophy, offers trust and commitment to best serve its customers. Our goal is to consistently provide high quality products and services that exceed the expectations of our customers, and to create excitement and cultural inspiration together with people around the world.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.