Learning with Leo: Drones—Meeting Demand Without Compromise
Nolan’s Notes: Our Spotlight on North America
Global Sourcing Spotlight: Building a Supply Chain That Bends, Not Breaks
iNEMI & ZESTRON Workshop: Advanced Packaging and its Impact on mm/Wave Applications
October 18, 2023 | iNEMIEstimated reading time: 1 minute
A workshop sponsored by iNEMI and ZESTRON Corporation will be held on November 7, 2023 at 9:00 a.m.-5:00 p.m.
This full-day workshop brings together industry-based and academic researchers to talk about the challenges of advanced packaging and its intersection with high-frequency (mmWave) materials. The morning session focuses on heterogeneous integration and the latest materials and processes for electronics packaging, and the afternoon session will cover highlights from the 5G/6G mmWave Materials and Electrical Test Technology Roadmap (5G/6G MAESTRO). Part of the NIST Advanced Manufacturing Technology (MfgTech) Roadmap program, MAESTRO is focused on creating a foundation of knowledge and expertise in the U.S. to support the development and manufacture of leading edge 5G and 6G products.
The workshop will be hosted by ZESTRON Americas in their Manassas, Virginia, facility and features speakers from
- Ajinomoto USA
- Florida International University
- Georgia Institute of Technology
- Intel
- iNEMI
- NIST
- Mosaic
- Penn State University
- SunRay Scientific
- ZESTRON
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
KYZEN to Highlight MICRONOX MX2123 Power Module Cleaner at IMAPS Wire Bonding Workshop
04/29/2026 | KYZENKYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the International Symposium on Microelectronics (IMAPS) Wire Bonding 2026 Workshop and Tabletop Exhibition, scheduled to take place May 12-13 at the Crowne Plaza Boston-Woburn in Woburn, MA.
The Global Electronics Association and ISC3 Announce Strategic Partnership to Advance Circular and Sustainable Electronics
02/18/2026 | Global Electronics AssociationThe Global Electronics Association Europe and the International Sustainable Chemistry Collaborative Centre (ISC3) announced a new strategic partnership, which aims to accelerate innovation and collaboration to address circularity and sustainability challenges across the global electronics value chain.
Advanced Electronic Packaging: How the Global Electronics Association Is Addressing Challenges and Needs in Malaysia
01/19/2026 | Devan Iyer and Matt Kelly, Global Electronics AssociationIn November, more than 200 industry leaders, including government officials, regional domestic companies, multinational companies, and academic experts, gathered at the Olive Tree Hotel in Penang for the Advanced Electronic Packaging (AEP) Workshop, organized by the Global Electronics Association. With 15 expert speakers, three technical tracks, three expert panel discussions, and strong ecosystem participation, the workshop highlighted why advanced electronic packaging is central to the future of Malaysia’s semiconductor industry.
AI Helps Build Smarter, More Resilient Power Grids
05/16/2025 | BUSINESS WIREAs society’s reliance on electricity deepens, artificial intelligence (AI) is reshaping how we manage power grids and optimize energy sources.
Improve Your Process Reliability: Axxon-Mycronic and HumiSeal to Host Conformal Coating Workshop in Guadalajara
04/15/2025 | Axxon-MycronicAxxon-Mycronic, a leading, global supplier of innovative and production-ready, dispensing and conformal coating systems, in collaboration with HumiSeal, a global expert in protective coating materials, is excited to announce a Conformal Coating Workshop taking place on May 8, 2025 in Guadalajara, Mexico.