TTM Technologies CFO Dan Boehle Wins CFO of the Year Award from the Los Angeles Business Journal
September 28, 2023 | TTM TechnologiesEstimated reading time: 1 minute

TTM Technologies, Inc., a leading global manufacturer of technology solutions including mission systems, radio frequency (RF) components and RF microwave/microelectronic assemblies, and printed circuit boards (PCB), announced that its Chief Financial Officer, Dan Boehle, was honored at the 2023 Los Angeles Business Journal (LABJ) CFO of the Year Awards ceremony. The ceremony was held on Thursday, September 21, 2023 at the Biltmore Hotel.
Boehle was presented with the Turnaround Achievement Award in recognition of his role as CFO of Aerojet Rocketdyne. In that role, he led his team, and the company, through major organizational and governance changes. Boehle’s finance and business acumen, and his consistent focus on providing the best and most valuable outcome for the company’s employees, shareholders, and customers made him a critical part of the senior management team that led the company through these changes and ultimately increased the market value and future sustainability of the company. Following the closure of the sale of Aerojet Rocketdyne to L3Harris, Dan joined TTM on August 21st, 2023 becoming the CFO on September 11th, 2023.
“We are excited to have Dan as part of the leadership team at TTM,” said Tom Edman, CEO of TTM. “He successfully led and navigated Aerojet Rocketdyne through complex challenges eventually leading to a sale that increased shareholder value and this recognition is well deserved.”
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Curtiss-Wright to Supply Turret Drive Stabilization Systems for U.S. Army XM30 Combat Vehicle Prototypes
10/16/2025 | BUSINESS WIRECurtiss-Wright Corporation announced that it has been selected by American Rheinmetall to provide its Turret Drive Stabilization System (TDSS) for the prototype phase of the U.S. Army’s XM30 Combat Vehicle (CV) program, which was recently approved to advance to Milestone B, the Engineering and Manufacturing Development (EMD) phase.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
American Standard Circuits Achieves Successful AS9100 Recertification
10/14/2025 | American Standard CircuitsAmerican Standard Circuits (ASC), a leading manufacturer of advanced printed circuit boards, proudly announces the successful completion of its AS9100 recertification audit. This milestone reaffirms ASC’s ongoing commitment to the highest levels of quality, reliability, and process control required to serve aerospace, defense, space, and other mission-critical industries.
Imec Launches 300mm GaN Program to Develop Advanced Power Devices and Reduce Manufacturing Costs
10/13/2025 | ImecImec, a world-leading research and innovation hub in nanoelectronics and digital technologies, welcomes AIXTRON, GlobalFoundries, KLA Corporation, Synopsys, and Veeco as first partners in its 300mm gallium-nitride (GaN) open innovation program track for low- and high-voltage power electronics applications.
Renesas Powers 800 Volt Direct Current AI Data Center Architecture with Next-Generation Power Semiconductors
10/13/2025 | RenesasRenesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced that it is supporting efficient power conversion and distribution for the 800 Volt Direct Current power architecture announced by NVIDIA, helping fuel the next wave of smarter, faster AI infrastructure.